Micron announced that it has successfully trial-produced the world’s first chip “uMCP5” that integrates LPDDR5 DRAM memory particles and 96-layer stacked 3D NAND flash memory Chips, targeting mainstream and flagship 5G smartphones that pursue high-speed memory and high-performance storage. , of course, it is no problem to use it in mid-to-high-end 4G mobile phones.
Today’s 5G flagship mobile phones have LPDDR5 memory and UFS 3.0/3.1 flash memory as standard configurations, and they are all large-capacity, but since the memory in traditional mobile phones is integrated with the SoC processor, the flash memory is an independent chip. , will take up a lot of space, coupled with the sharp increase in the internal components of 5G mobile phones, the structure is very complex, and the overall design difficulty is greatly increased.
The Micron uMCP5 single-chip integrates 12GB capacity, 6400MHz frequency, dual-channel LPDDR5 memory manufactured by the second-generation 10nm process, 256GB capacity, 96-layer stacking, 3D TLC flash memory with UFS interface, and on-board controller. Externally, it is 297 pins Standard BGA package.
Micron said that the uMCP5 can save 40% of the area compared to the traditional dual-chip combination of memory and flash memory, and at the same time, the memory and storage bandwidth are increased by 50% compared with the previous generation solution.
Micron said the uMCP5 chip has been sampling to select customers, but did not disclose who.
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Author: above text Q