The shipborne multi-channel communications intelligence system (COMINT system) produced by Rohde & Schwarz can enhance the situational awareness of naval ships and expand the reconnaissance and surveillance capabilities of ships.
The world’s navies need to face the challenges of diverse missions. In addition to traditional military missions, new missions include counter-terrorism, anti-piracy, anti-smuggling, and combating organized crime at sea. With the increasing number of asymmetric warfare and peacekeeping missions in the open and near seas, ships need to be capable of performing diverse missions. To adapt to this new situation, the Navy needs to be more flexible in the use of personnel and equipment.
The shipborne multi-channel communications intelligence system (COMINT system) provided by Rohde & Schwarz can improve the combat effectiveness and battlefield survivability of individual ships and entire fleets. The system enhances the ship’s early warning capabilities and situational awareness. The system can also effectively provide intelligence support and hazard alerts for specific missions (such as Marines landing off-ships for hostage rescue missions) through intercepted communications. The system gathers valuable information to provide fleet-wide intelligence.
The shipboard multi-channel communications intelligence system can set up automatic detection and surveillance tasks. As a highly integrated monitoring, direction finding and analysis system, the system can automatically process fixed frequency signals, frequency hopping signals and various HF/VHF/UHF radio communication signals.
The system can automatically detect, identify, demodulate and decode signals, and Display the processing results in real time. It is capable of recording demodulated digital audio or recording signal digital IF. The system can prompt the operator to deal with enemy signals and unknown signals, and can automatically update the area situation map according to the monitoring results.
Rohde & Schwarz’s shipboard multi-channel communications intelligence system is capable of detecting and monitoring communications activity in the HF/VHF/UHF frequency bands. The system can display the incoming wave direction of the target radiation source and the geographic location of the radiation source on the Electronic map.
The wideband receiver equipped with the system has the function of digital down-conversion, which can realize parallel monitoring of multi-channel signals. The system’s signal processing functions include intercepting analog voice signals, demodulating and decoding digital signals, automatic signal recognition and restoration of communication content, and the system can also record and playback signals.
The open architecture of the system allows users to customize decoders, and provides corresponding tools to assist users in the development of customized decoders. The system also has the functions of data output and third-party data import.
Rohde & Schwarz’s shipboard multi-channel communications intelligence system contains a database for processing various types of intercepted information. The intelligent algorithm of the database can match the newly entered intercepted data with the parameters of the known radiation sources in the database, so as to realize the functions of identifying the communication network and updating the regional situation picture.
Bosco Novak, Executive Vice President, Monitoring and Network Testing at Rohde & Schwarz, explains: “The shipboard multi-channel communications intelligence system from Rohde & Schwarz can be used both as a stand-alone system and as a subsystem and Deep integration and collaboration with other subsystems.”
For more information, please click:https://www.rohde-schwarz.com.cn.
On April 27, 2020, the Xiaomi brand under the Xiaomi Group held a new product launch conference. Two blockbuster new products, Xiaomi 10 Youth Edition and MIUI12, were officially released, along with the Xiaomi Watch Color X Keith Haring Joint Edition and Xiaomi Bluetooth Headset Line Free .
Xiaomi Mi 10 Youth Edition is a product tailored for young people from three dimensions: “doing a good job in the basic performance that young people care about most”, “adding the high-end experience that young people yearn for the most”, and “customizing fashionable design for young people”. The new 5G mobile phone has a thin and light body that is only 7.88mm thick and weighs 192g, with colorful colors, a rear 48 million AI quad-camera, and a 50x periscope zoom lens was introduced for the first time in the 2,000 yuan price segment, which supports AI portraits The new AI camera gameplay such as clone, front and rear cameras, kaleidoscope camera, dynamic sky change, etc., make young people’s favorite photos and creations more vivid and interesting.
In the core configuration, it is equipped with Snapdragon 765G, standard Samsung AMOLED professional primary color screen, built-in 4160mAh large battery, full-featured NFC, infrared remote control, linear motor and other high-specification configurations are readily available, providing young consumers with a leading 5G experience.
The newly released MIUI12 has carried out innovative design and upgrades for visual effects, privacy and security. Based on the design concept of “feel the reality, touch the imagination”, MIUI12 uses the new self-developed Miyou light cone dynamic effect architecture from the bottom of the system. Optimization, aesthetic design and vivid synaesthesia visualization design style run through the entire system, bringing the overall visualization effect and fluency to a whole new level.
The grand launch of the super wallpaper function revolutionaryly connects the screen, lock screen and the system desktop, renders it in real time with a game-level engine, and presents visual wonders beyond imagination, which can be called the world’s top choice for aesthetics and dynamic effects. In terms of privacy, MIUI 12 provides three functional modules: flares, interception nets, and hidden masks, to achieve all-round protection of users’ personal privacy data.
Industry insiders said that this year, mainstream manufacturers began to plan products with the idea of ”medium cup, large cup, and super large cup”, and reduced allocations step by step from top to bottom, so as to achieve full coverage of product lines in the price range. The planning of the Xiaomi Mi 10 series has been redesigned and planned in a targeted manner from the perspective of different user needs, so that the Xiaomi Mi 10 Youth Edition, Xiaomi Mi 10 and Xiaomi Mi 10 Pro have distinct user audiences.
The Xiaomi Mi 10 series, which hit the high-end for the first time and was a great success, has accumulated an excellent reputation, and its sales quickly exceeded 1 million, becoming a phenomenal product in the current market. Xiaomi Mi 10 Youth Edition directly meets the needs of young consumers in terms of design and function, popularizing 50x periscope zoom in 2,000 yuan 5G mobile phones, officially announcing the demise of 4G mobile phones. At the same time, MIUI12, as the pinnacle of MIUI’s tenth anniversary, has achieved a subversive leap in core animation and data privacy protection, and is considered to be comparable to iOS, setting a new benchmark for the industry.
The Xiaomi Mi 10 Youth Edition will start pre-sale at 16:00 on April 27th, and will be sold through all channels on April 30th. The Xiaomi Watch Color Keith Haring joint version will start full pre-sale at 16:00 on April 27, priced at 899 yuan. The Xiaomi Bluetooth headset Line Free will go on sale at 16:00 on April 27, priced at 199 yuan.
The new 5G infrastructure has accelerated, and Xiaomi, which has no 4G inventory pressure, is fully promoting the popularization of 5G mobile phones
According to the latest data released by the three major operators of China Mobile, China Unicom and China Telecom, more than 550,000 5G base stations are expected to be put into operation nationwide by the end of the year, and the 5G network will fully cover cities above the prefecture level in the country. The overall acceleration of new 5G infrastructure will further promote 5G terminals. rapid spread.
Lei Jun, founder, chairman and CEO of Xiaomi Group, stated in the Chairman’s open letter in the 2019 annual report that the global mobile communication technology industry is at a critical moment of switching from 4G to 5G, and Xiaomi Group has adopted a stable business strategy to continue to consolidate quality. , innovation, delivery and other capabilities, a series of major adjustments have been made to the brand, product line, organizational structure and management system, laying a solid foundation for future development.
The global extremely healthy inventory level that is rare in the industry has been achieved, and the 5G strategy has been launched lightly. At the beginning of 2020, Xiaomi mobile phones hit the high-end market for the first time and launched the 5G high-end flagship Xiaomi Mi 10 series. Although it encountered a black swan event such as the “new coronavirus”, with its leading 5G performance and many innovative features, the Xiaomi Mi 10 series is in the market. After the release, it aroused great enthusiasm among consumers, and directly activated the high-end market in the beginning of the year. The sales volume quickly exceeded 1 million units, becoming a well-deserved hot product among the 5G flagships in the beginning of the year.
After gaining a firm foothold in the high-end market, Xiaomi Mobile further set its sights on the mid-end market and launched the Xiaomi Mi 10 Youth Edition for younger consumer groups. Xiaomi Mi 10 Youth Edition has carried out a brand-new product demand for young people from the three dimensions of “doing a good job in the basic performance that young people care about the most”, “adding the high-end experience that young people are most yearning for”, and “customizing fashionable design for young people”. The design of Xiaomi Mi 10 and Xiaomi Mi 10 Pro present a completely different style. The Xiaomi Mi 10 Youth Edition has a more lively and beautiful body design and a more interesting way of taking pictures. As for the antibacterial protective case, it shows in-depth insights into the consumption habits of young people without exception, and is committed to further popularizing the leading 5G experience among young consumer groups.
Thin and colorful + 50x periscope zoom, Xiaomi Mi 10 Youth Edition creates an exclusive personalized 5G mobile phone for young people
The Xiaomi Mi 10 Youth Edition takes lightness and thinness as the key indicator of its design, and adjusts the details of the screen, heat dissipation, lens, etc. one by one, making it a rare thin and light product among 5G mobile phones. The weight of the whole machine is only 192g, and the thickness is only 7.88mm. It is light and portable, and can be easily stored in the cosmetic bag carried by girls without the slightest burden.
Xiaomi Mi 10 Youth Edition has also been redesigned in color matching, drawing inspiration from the colorful milk tea drinks, bringing four seasons spring milk green, grape grapefruit, white peach oolong, blueberry mint, black Qiao storm five colors, each of which is It conveys a unique personality and becomes a fashion item in the hands of young people.
Xiaomi knows the importance of a good screen for young people. Therefore, all models of Xiaomi Mi 10 Youth Edition come standard with a professionally-tuned Samsung AMOLED professional primary color screen with clearer Display and more accurate color reproduction, and has passed the HDR10+ certification. The high brightness and contrast performance can accurately restore the light and shadow details in the picture, and have a clear and comfortable look even in the sun.
Young people are keen on unique beauty shots, short videos and vlog creation, so Xiaomi Mi 10 Youth Edition has made great efforts in the camera, equipped with 48 million high-definition + 8 million super wide-angle + 8 million periscope telephoto + 2 million macro full scene The AI quad-camera introduces the flagship 50x periscope zoom camera solution for the first time. Through the precise split OIS drive, it can flexibly compensate for the displacement caused by shaking. In the environment of 15 kilometers, you can even see the images 15 kilometers away.
In terms of video, Xiaomi Mi 10 Youth Edition supports movie special effects cameras. While inheriting more than 10 professional video features of Xiaomi, it also adds interesting gameplay such as kaleidoscope special effects, AI portrait avatars, magic sky changing, and simultaneous shooting in front and rear. Among them, the AI portrait avatar is based on the algorithm developed by Xiaomi AI Lab. It does not require stable equipment such as tripods and gimbal, and can take pictures of yourself playing games with yourself, hip-hop battles and other wonderful scenes. This kind of special effects scenes that were only used in science fiction movies in the past can be realized by a Mi 10 Youth Edition with unrestrained imagination, which greatly increases the fun of shooting.
In terms of core configuration, Xiaomi Mi 10 Youth Edition adopts Snapdragon 765G, supports SA/NSA dual-mode 5G network, suspended heat pipe for heat dissipation, built-in 4160mAh large battery, retains 3.5mm headphone port, equipped with 1216 super linear speakers, and supports Hi-Res Audio certified. In addition, the screen fingerprint, full-featured NFC, infrared remote control, linear motor and other high-specification configurations are readily available, and a silver ion antibacterial protective shell + protective film is included.
Miyou light cone architecture creates top system animation, MIUI12 challenges the world’s strongest iOS
MIUI has been established for nearly ten years and has 310 million users around the world. It is currently a very representative mobile phone system brand in the Android field. The MIUI12 released this time takes “touch the imagination, feel the reality” as the core design concept of the product, adopts the self-developed Miyou light cone architecture, rewrites the underlying system architecture, and the overall animation effect is completely new, and the core scene animation is comparable to iOS. At the same time, MIUI12 brings a new synaesthesia visualization design, and the vivid animation effects run through the entire system UI.
The grand launch of the super wallpaper function is the first time in the world to realize the revolutionary connection of the screen, lock screen and system desktop. It is rendered in real time with a game-level engine, and the two planets of Mars and Earth are instantly brought to the user’s fingertips, achieving coherence and super Unlocking the unimaginable experience, you can experience the magical journey through space within a square inch.
Xiaomi MIUI has always been committed to user information security and privacy protection. The new MIUI 12 introduces the functional design of three modules: flares, interception nets, and hidden masks. The flares can faithfully record the sensitive behavior of the app and present it completely, so that all small actions have nowhere to escape. The interception network gives users more choices and the right to decide the permissions of the app, and can choose to actively erase sensitive information such as the shooting location when sharing photos; the hidden mask can provide blank identity information to rogue apps, and solve the problem that the app does not give The issue of permission not to be used, in order to strengthen the initiative of privacy data control. At present, MIUI has obtained privacy protection certifications from many authoritative organizations including China, Europe, and the United States. MIUI12 is also the first mobile phone system in the world to pass the TÜV Rheinland “Android System Enhanced Privacy Protection Test”.
MIUI 12 also brings many new features, such as AI calls, global free windows, Xiaomi health, a new control center, dark mode 2.0 that adapts to almost all applications, better and fun sticky notes, more efficient, convenient and practical Calendar, more intimate and smart smart travel, etc. MIUI12 has started the application for the development version of the internal test, and the stable version will be upgraded gradually from the end of June, with more than 40 compatible models.
The collision of technology and trend, Xiaomi Watch Color Keith Haring joint version released
At this conference, Xiaomi also brought a brand new Mi Watch Color Keith Haring co-branded version, which fully integrates Keith haring’s unrestrained trendy pop style in the design concept, making Xiaomi Watch Color a “trend icon” in the smartwatch industry. “.
The Xiaomi Watch Color Keith Haring Co-branded Edition comes in a collection-grade exquisite gift box, built-in exclusive custom watch strap, Keith Haring art medal, 14-day long battery life, supports 10 major sports modes, monitoring sleep, stress, 24-hour heart rate, body energy and other health data; the standard multi-function NFC makes bus travel and consumption payment more convenient, and supports Xiaoai voice operation, which can be linked with more than 1,000 smart home devices. The pre-sale of the full price is 899 yuan from now on.
The Xiaomi Bluetooth headset Line Free, released together, uses the Qualcomm QCC5125 flagship chip, which can automatically adjust to provide the best sound quality or lower latency according to the playback content of the device. The price is 199 yuan.
Faced with the accelerating popularization of 5G, Xiaomi has made the best preparations. Xiaomi Mi 10 and Xiaomi Mi 10 Pro use high-end and extreme performance experience to stand firm in the high-end 5G market. Excellent 50x periscope zoom camera, more affordable price, promote the popularity of 5G mobile phones among young people.
The MIUI12 released this time not only makes the comprehensive experience and security of the Android system comparable to the iOS system for the first time, but also further consolidates the industry leadership of Xiaomi mobile phones in the Android camp in terms of interactive experience, visual effects and security privacy. Enhance the competitiveness of Xiaomi 5G mobile phones. At the same time, based on its leading advantage in the field of intelligent ecology, Xiaomi AIoT smart device categories and application scenarios have become more and more abundant, forming a strong ecological chain synergy effect of mobile phone + AIoT dual-engine, providing consumers with the most complete intelligent interoperability in 5G scenarios, Connected ecological experience.
Blood oxygen level is a reflection of a person’s physical fitness. Blood oxygen saturation is an important parameter reflecting the blood circulatory system and respiratory circulatory system, and an important indicator to judge whether the human body is healthy or whether the surrounding environment is hypoxic. The normal level of the human body should be above 95% oxygen saturation. When the concentration of blood oxygen in the blood is low, it can affect the normal working of organs such as the heart and brain. Many clinical diseases will cause the lack of oxygen supply, which will directly affect the normal metabolism of cells, and even threaten human life in serious cases. Therefore, real-time monitoring of blood oxygen saturation is very important in clinical rescue.
Classification and principle of blood oxygen saturation detection
The measurement of blood oxygen saturation is usually divided into two categories: electrochemical method and optical method.
The traditional electrochemical method of blood oxygen saturation measurement requires blood collection from the human body (arterial blood is most commonly used), and then electrochemical analysis is performed using a blood gas analyzer to measure the arterial oxygen partial pressure (Pa02) within a few minutes. And calculate the arterial oxygen saturation (Sa02). Since this method requires arterial puncture or cannulation, causes pain to the patient, and cannot be continuously monitored, it is difficult for the patient to receive timely treatment when in a dangerous situation. The advantage of the electrochemical method is that the measurement results are accurate and reliable, but the disadvantage is that it is troublesome and cannot be continuously monitored.
Optical method is a new optical measurement method that overcomes the shortcomings of electrochemical method. It is a continuous non-invasive blood oxygen measurement method that can be used in emergency wards, operating rooms, recovery rooms and sleep research. At present, pulse oximetry is the most widely used method. Its principle is to monitor the change of blood absorption of light, measure the percentage of oxyhemoglobin (Hb02) in total hemoglobin (Hb), and directly obtain Sp02.
The non-invasive oximeter mainly consists of a microprocessor, memory (EPROM and RAM), two digital-to-analog converters that control the LEDs, a sensor that filters and amplifies the signal received by the photodiode, and digitizes the received signal. It consists of an analog-to-digital converter provided to the microprocessor.
▲ Principle diagram of blood oxygen saturation meter
The advantage of this method is that it can continuously measure the human body without damage, and the instrument is simple and convenient to use, so it has been paid more and more attention. The disadvantage is that the measurement accuracy is lower than that of the electrochemical method, and the error is larger when the blood oxygen value is low. Using the principle of optical method, ear oximeters, multi-wavelength oximeters and the newly developed pulse oximeters have appeared successively. Require. Although they are less than satisfactory in some respects, the clinical benefits they produce are widely recognized.
Photoelectric sensor for non-invasive blood oxygen saturation monitoring
The sensor is a key component that can sense the partial pressure of oxygen in the blood and convert it into a usable output signal. Its damage will directly lead to inaccurate detection or failure of the whole machine to work. The blood oxygen sensor can be mainly divided into finger type, earlobe type, wrapping type and adhesive type according to the shape. No matter what the shape is, the principle and composition of blood oxygen sensors are the same, and they are composed of light-emitting devices and receiving devices. The light-emitting device is composed of red light with a wavelength of 660nm (650nm) and an infrared light-emitting tube with a wavelength of 940nm (910nm). Most of the photosensitive receiving devices use PIN-type photodiodes with large receiving area, high sensitivity, small dark current and low noise, which convert the received incident light signal into electrical signal.
Most of the newly developed pulse oximeters use a finger-sleeve sensor probe, which is placed on the fingertip when in use. Two light-emitting diodes placed side by side are fixed on the upper wall of the finger sleeve, and the light-emitting wavelengths are respectively 660nm red light and 940nm infrared light. The lower wall is a photosensitive receiving device, which converts the red and infrared light transmitted through the finger into electrical signals. When the oximeter is running, the time-sharing driving circuit makes the two light-emitting diodes emit light at a certain time interval and with a relatively low duty cycle. Calculate the whole blood absorption rate a660 and a940, and then combine the experimental calibration coefficients A and B, and substitute them into a special formula to calculate the value of blood oxygen saturation.
▲ Finger oximeter
Centaurus blood oxygen optical sensor
The SpO2 blood oxygen optical sensor developed by FATRI is a sensor that provides blood oxygen saturation measurement using a new optical measurement method, which can perform high-precision blood oxygen level detection and has the best flexibility to accommodate multiple wavelength options. The KGXV01 series of sensors are specially developed and designed for medical applications with the critical requirement of peak wavelength selection. The source material is GaAIAs combined with GaAIP with a clear epoxy lens. Due to FATRI’s ability to provide components and complete sensor packages, this sensor is characterized by high precision, durability and high performance.
▲Related parameters of FATRI KGXV01 series sensor
FATRI Health and Medical Division focuses on the research and development, production and sales of health and medical high-tech products. In the future, FATRI will be committed to using modern advanced materials science, sensing technology, molecular biology and artificial intelligence technology to develop new products for treatment, surgical assistance, detection and postoperative detection. Combining detection technology, Internet technology and the medical industry, we deeply explore the meaning behind various health data, and strive to use disruptive technology to solve the pain points of human health and improve human health.
According to data from the Ministry of Industry and Information Technology, as of the end of August 2021, my country has built more than 1 million 5G base stations, accounting for more than 70% of the world’s total, and the number of 5G terminal connections has exceeded 400 million. China is already the world’s largest 5G market. In the first six months of 2021 alone, 190,000 5G base stations will be built. By 2030, the number of 5G base stations in my country is expected to reach 15 million.
With the construction of 5G base stations, 5G application scenarios are entering the stage of large-scale implementation. The upstream of the base station industry chain requires a large number of Chips and modules. The penetration and popularization of small base stations will undoubtedly become another “fertile ground” for the semiconductor industry.
5G has clear requirements for small base stations
According to the standard of 3GPP (third generation mobile communication standard), wireless base stations can be divided into 4 categories, namely macro base station, micro base station, pico base station and femto base station. Femto base stations are collectively referred to as small base stations.
Types of base stations in the 5G era, organized by the semiconductor industry
Macro base station and pico base station.Source: pixabay, Ericsson
With the continuous construction of 5G networks, 5G business scenarios have begun to shift from outdoor to indoor, and the market is more inclined to use small cells in indoor scenarios. Because of the operating frequency bands of the four major operators previously released by the Ministry of Industry and Information Technology, the 5G frequency bands are distributed between 2515MHz and 4900MHz, and the higher the frequency, the shorter the wavelength. During transmission, the signal is attenuated to a greater degree, and its radiation range will become very small where obstacles are encountered.
Chinese operator 5G spectrum.Source: China Galaxy Securities Research Institute
In fact, small cells are not exclusive to the 5G era, and have been deployed as early as the 4G era. However, since the macro base station in the 4G era can carry more than 70% of the traffic, the usage of the small base station is not much. In the transition from 4G base stations to 5G base stations, due to the limitations of national network construction, small base stations have become a necessary supplement, especially the construction of indoor networks. At present, China’s 5G network layout has formed a situation of “macro base station foundation and small base station supplement”. Small cells can fill the gaps caused by insufficient land space and insufficient budget.
The use of a 5G small base station in the floor.Source: Bikoc
Because of the unique role of small base stations, it is expected to usher in its own market opportunities. Market research firm Dell’Oro predicts that the global small cell market will reach US$25 billion in the next five years. According to ABI research, the global indoor small cell market will reach US$1.8 billion in 2021.
Unlike consumer grades, small cell chips require a high degree of maturity and reliability. At present, because the characteristics of FPGA and ASIC have different usage scenarios and characteristics, the core main control chip of 5G small base station occupies the mainstream market with SoC of FPGA and ASIC chip. . Relevant people in the industry believe that from 4G small base stations to 5G small base stations, what needs to be broken is the core main control chip, especially the integrated digital chip with high computing power and low power consumption as a dedicated main control chip. Coincidentally, some people in the industry have also analyzed that if a 5G small base station is disassembled, the most expensive one is an FPGA main control general-purpose chip with a price of about 600 US dollars, which exceeds the sum of the other chips on the small base station.
The three major players share the “world” of 5G small base station chips
Many big manufacturers have occupied the vast market starting from 4G base station chip solutions, and this strong market position has also continued to 5G base stations. At present, 5G small base station chips are still monopolized by major international manufacturers. After Broadcom withdrew from the market, Intel, NXP, and Qualcomm became the three major players.
In 2019, Intel and China Mobile Research Institute launched the world’s first commercial 5G open platform small base station at “MWC19 Shanghai (Mobile World Congress)”, opening a new round of industry commercial product innovation. In this small base station, Intel used Xeon processors and its FPGA products, and the application of the jointly built small base station on the cloud covers indoor 5G scenarios.
In Intel’s platform designed for 5G small cells, RRU (Remote Radio Unit) is based on Intel Arria10 FPGA. Arria10 FPGA and SoC serial transceiver provide broadband, low-latency, and low-power options, which can support the development of high-speed communication systems. Ideal for wireless base stations. Intel’s current end-to-end solutions based on Flex RAN have been widely adopted by the vast majority of 5G small cells.
In NXP’s 5G small base station products, SoC and programmable baseband are also its main areas. At present, NXP already has two communication processors for 5G small base stations – LS1046A and LS1026A multi-core processors. The two processors integrate quad-core and dual-core 64-bit Arm Cortex-A72 with packet processing acceleration and high-speed peripherals. In the field of programmable baseband processors, the LS1043A processor is NXP’s first quad-core 64-bit Arm processor for embedded networks, delivering performance over 10 Gbps.
Layerscape LA1200 is a programmable baseband processor 5G-NR fixed wireless edge access and 3GPP infrastructure equipment launched by NXP. The LA1200 splits options, proprietary applications and value-added differentiation for O-RAN functions through PHY/baseband processing, and is still in the sample stage.
Qualcomm has shown strong enthusiasm in the 5G field. Its FSM100xx released in 2018 is a classic 5G small cell chip solution and the first 5G new air interface (5G NR) solution. This ASIC chip uses a 10nm process and can support both millimeter wave and Sub-6GHz frequency bands, and can support both non-standalone (NSA) mode and independent networking (SA) mode.
At the end of last year, Qualcomm announced that it had reached a purchase agreement with Nokia to provide it with a new 5G indoor small cell chipset, the FSM100xx 5G RAN. This purchase became a major victory for Qualcomm in the 5G RAN market.
On June 28 this year, Qualcomm Technologies once again announced the launch of its second-generation Qualcomm 5G RAN platform for small cells (FSM200xx), the first 5G openRAN platform compliant with the 3GPP Release 16 specification. Features such as eURLLC it supports can provide the low latency and link reliability required for factory automation and mission-critical machine equipment control.
China has entered the stage of mass production
The domestic 5G small base station architecture is usually three levels of distributed BBU + switch + RRU. Among them, the active room sub-system represented by Huawei Lampsite and ZTE Qcell has become the mainstream of 5G indoor, and the small base station chips of both use ASIC, and Unpublished.
Huawei pRRU uses its exclusive self-developed ASIC “ultra-broadband” chip, and officially commercialized the 5G LampSite 100MHz bandwidth product in 2019. GlobalData, a telecommunications industry consultancy, rated LampSite as the “leader” in the field of Enterprise Small Cells, winning the title for three consecutive years. Last year, Huawei launched the 5G LampSite 200MHz pRRU using its self-developed chips, which can support multiple frequencies and enable integrated 4G/5G deployment for new indoor scenarios. 5G LampSite 300MHz supports C-Band single frequency, which can support the co-construction and sharing of operators.
In addition to Huawei and ZTE, some semiconductor startups have also targeted this market and began to emerge.
Bikochi Microelectronics is one of them. On June 9, Bikoqi Microelectronics completed the Pre B round of financing of nearly 100 million yuan. One of the main businesses of the Hangzhou-based company is to provide openRAN standard SoCs for 5G small cell equipment manufacturers. At present, Bikoqi has launched PC802 small base station chip, PC802 can be used for 5G integrated and distributed, expandable small base station, and supports URLLC. This chip uses the RISC-V architecture, and the recently launched ORANIC 5G board embeds four PC802s, which can provide four 25G Ethernet SFP connectors.
At the 2021 China Beijing International Communication Exhibition, Silang Technology officially released two 5G small cell chips UCP1002 and UCP4008. Silang Technology said that the UCP1002 chip is the first 5G small base station chip with its own core. In July last year, the UCP1002 was taped out. UCP series chips are based on MaPU technology and the “concentric circle” source model, and use the self-developed AppAISArc command system, which has become a highlight product of domestic small base station chips. At the same time, at this communication exhibition, Silang Technology announced the launch of the UCP4008 chip mainly for enterprise-level application scenarios. The company said that this will be the first enterprise-level 5G small base station chip in China.
In 2020, China has become the largest market for 5G. Last year, the number of 5G connections in China exceeded 200 million. However, the upstream chip of 5G small base station started late. Compared with many communication manufacturers in the midstream and many downstream application scenarios, the degree of localization is low, and the number of participants has become an urgent problem to be solved.
Broad market has opened
As mentioned above, the three giants Intel, NXP, and Qualcomm use FPGA, Arm multi-core architecture and ASIC chips respectively, while China values ASIC and RISC-V architecture. ASIC has strong customization, lower power consumption and stronger performance, and has become the preferred architecture of major domestic players. The RISC-V architecture has become the “new favorite” of domestic players because of its open source characteristics.
According to the calculation of the semiconductor industry, the market size of the domestic 5G small base station may exceed 25 billion yuan by 2025. Relevant agencies have estimated that the number of 5G small base stations in China is expected to reach about 10 million by 2025. If the average price of the small base station market is estimated at 2,500 yuan, the domestic market size may exceed 25 billion yuan conservatively.
With the “attractive” market prospects ahead, how to go upstream in the competitive landscape has become a topic that domestic companies must face. Compared with foreign manufacturers, domestic companies have a better understanding of the Chinese market and can create products with excellent performance and power consumption, as well as a safe and reliable ecosystem. If you have a goal, you are not afraid of the long road. The 5G small base station chip is waiting for the passers-by in the starlight.
X-FAB Silicon Foundries (“X-FAB”), a leading analog wafer foundry company, and Pinejie, a domestic SiC power device supplier, jointly announced that the two parties have established a long-term strategic partnership for mass production of SiC wafers. nearly three years.
Headquartered in Europe, X-FAB is the first foundry in the world to offer a 150mm SiC process. X-FAB’s automotive-quality production environment can help customers produce high-quality, high-performance devices that can be brought to market quickly.
As an important partner of X-FAB in Asia, it is understood that Pinejie has shipped 10 million in the past three years, and it is expected to exceed 80 million in the next three years.
From the official website of Pinejie, Pinejie is a third-generation semiconductor power device designer and solution provider established in September 2018. The founder, Dr. Huang Xing, studied under B. Jayant Baliga, the father of IGBT, and has ten years of experience in SiC&GaN power device design in Cree / RFMD (Qorvo) / UnitedSiC, etc. It can be seen that Pinjie SiC & GaN power devices come with American semiconductor technology genes, which have innate technical advantages and technical strength. This is also proved by the product development history of Pinjie.
In March 2019, Pinjie released the first 650V GaN power device compatible with driving only 6 months after its establishment. In August of the same year, the 1200V SiC MOS of Gen3 technology was completed, filling the domestic gap. In 2020, 650V and 1700V industrial-grade MOS for 5G data centers, servers and industrial auxiliary power supplies, and 650V vehicle-grade MOS for on-board chargers will be released successively. In February 2021, the 1200V high-current automotive-grade MOS will be released, which will be used in electric vehicle electric drive single tubes and modules.
Up to now, Pinjie has released more than 50 650V/1200V/1700V SiC SBD, SiC MOS, GaN HEMT power device products.
Both Pinejie and X-FAB stated that the two parties will continue to cooperate in depth, give full play to Pinejie’s international first-class product technology advantages and X-FAB’s high scalability and automotive quality foundry services, reduce the cost of SiC devices, Guarantee production capacity and accelerate the use of SiC power devices in big data centers, supercomputing and blockchain, 5G communication base stations, new energy vehicles/energy storage/charging piles, micro photovoltaics, intercity high-speed railways and intercity rail transit, household appliances and special The application of high voltage, aerospace, industrial special power supply, UPS, motor drive and other fields promotes the development of the global SiC industry.
The chip size of a mobile phone processor is about the size of a thumb nail, but a small chip can hold tens of billions of transistors. The mobile phone processor A14 in the iPhone 12 is equipped with a 5-nanometer process and integrates 11.8 billion transistors.
Can such a small chip really hold tens of billions of transistors?
A nanometer (nm) is a unit of length, and one nanometer is equal to 10 minus 9 square meters, which is a very small unit of length. Mount Everest is 8,848 meters high, one millionth of its height, only the thickness of a book. And 1 nanometer is equivalent to one millionth of a millimeter. A single bacterium is invisible to the naked eye because its diameter is in the micrometer scale, and 1 nanometer is one thousandth of a micrometer.
The hydrogen atom is the smallest of the atoms, its radius is about 0.037 nanometers, and the length of 13 hydrogen atoms arranged in a line is about 1 nanometer. The current mobile phone CPU is a silicon-based chip, and the diameter of the silicon atom is 0.234nm, and the length of 4 silicon atoms is 1 nanometer in a row.
1 nanometer is so small, then it is easy to understand that it is possible to integrate 10 billion transistors on a small mobile phone chip.
When the world’s first computer, Eniac, appeared, it was bigger than a room. In 1958 Jack Kilby invented the integrated circuit based on silicon, and later Robert Noyce invented the integrated circuit based on silicon. Engineers built transistors directly on a silicon wafer, and microcircuits (Chips) were born. In order to reduce power consumption and improve performance, integrated circuits have more and more transistors, and components are made smaller and smaller.
Now the chip manufacturing process has already entered the nano-era from the micro-era. The CPU of mobile phones and computers is the most integrated chip. Now, the area of a mobile phone CPU is about 100 square millimeters, and one square millimeter can integrate at least 10 million transistors.
With the improvement of microelectronics technology, the silicon-based chip manufacturing process has entered the era of several nanometers from tens of nanometers in just a few years. At present, the manufacturing process of integrated circuits has reached the 5-nanometer level, and the Apple A14 processor uses TSMC’s 5-nanometer manufacturing process. However, the scale of components is approaching the limit. To improve the performance of the chip, you can only find other methods, such as carbon-based semiconductors.
Nanotechnology is the study of the properties and applications of materials with a structure size in the range of 1 to 100 nanometers.
The concept of nanotechnology was first proposed by physicist Richard Feynman in 1959. It was not until 1981 that scientists invented the scanning tunneling microscope, and they had the ability to see atoms and molecules at the nanoscale, and then have the ability to manipulate individual atoms.
“Soldering irons, solder extractors, and other devices that are in direct electrical contact with sensitive components can inject large amounts of energy into these devices. Specifically, the metal contact between the tip of the soldering iron tip and the pins of the component is a path for high current flow that can cause serious equipment damage.
“
Soldering irons, solder extractors, and other devices that are in direct electrical contact with sensitive components can inject large amounts of energy into these devices. Specifically, the metal contact between the tip of the soldering iron tip and the pins of the component is a path for high current flow that can cause serious equipment damage.
Where does the tip of the soldering iron get its voltage? After all, it should be grounded, like a PCB with components, so in theory there should be no voltage difference, so there should be no harmful current flow between the tip and the device. However, this may be true only for DC or very low frequencies such as mains (50/60Hz). For high frequency signals, it can be quite different.
Transient signals as a source of EOS
Assuming the tip of the iron is properly grounded, the voltage on it can be reached primarily through the ground connection, and to some extent through capacitive coupling between the heating element and the tip.
Ground itself does not produce any signal. However, the ground wire connects the entire plant, and once some stray electrical signal enters the ground network, that signal can travel great distances.
The main source of voltage on ground is transient signals leaking from power lines.Transient signals can come from a variety of sources, such as switching power supplies, thyristor controls, servo motors, equipment commutation, etc.[1]. These signals can reach large amplitudes. Figure 1 shows the transient signal on the power line caused by turning on a ubiquitous heat gun. As you can see, the peak signal reached 13.3V, which is not the highest signal found in a manufacturing environment running a lot of high current equipment.
Since neutral and ground will eventually be connected together at some point, and since leakage currents (parasitic currents between power and ground) are present in almost all equipment, in manufacturing equipment, to a higher degree also These transient signals are present on the ground. The current leakage at high frequencies is significantly higher than the leakage typically specified at power line frequencies. This is due to the greatly reduced impedance of parasitic capacitive coupling at higher frequencies. Due to the complexity of the ground network and the increased leakage of the soldering iron itself at high frequencies, there is a high probability of current spikes between the grounded soldering iron tip and the grounded PC board with components.
What is acceptable and safe?
There are many standards and recommendations for limiting the signal on soldering iron tips. STM13.1-2000 of the ESD Association [2]Set the current limit to 10mA and the voltage limit to 20mV. Although the test setups in this document imply a mains (50/60Hz) signal, no limits are specified for signal characteristics. It should be noted that the current limits in this document are approximately 15 years old (it takes at least three years for documentation to be completed and published within a standards body); current current limits should be significantly reduced to reflect the higher sensitivity of today’s components .
The now obsolete MIL-STD-2000 [3]and its associated military standards specify that the voltage on the tip must not exceed 2mV RMS. The RMS value can be extremely misleading for transient signals. 2mV RMS may translate into a very high peak voltage of the transient signal C The voltage spike may be very narrow, i.e. the duty cycle is very short C Please refer to Figure 2 to see the difference between the peak and RMS value of the transient signal, which also comes from On the same heat gun on the bench, the time base is extended to what a typical multimeter can measure. The 761mV peak only translates to a 15.8mV RMS signal – 48 times that in this case. For such waveforms, a 2mV RMS signal will translate to a 96mV peak signal. Obviously, RMS values are not the best way to specify a signal on a soldering iron tip.
Section 2.5.33.2 of the IPC-TM-650 allows 2V peak voltage to be provided on the tip of the soldering iron, which is very high; Section 2.5.33.3 of the same document allows currents up to 1µA to be measured with a multimeter, rather than providing RMS or average scope.
Unlike the above IPC standards, IPC-A-610-E [4]It is the most basic document to control the quality of PCB assembly, providing the following instructions:
3.1.1 EOS/ESD Prevention C Electrical Overstress (EOS)
…tools and equipment need to be carefully tested to ensure that they do not generate destructive energy, including voltage spikes, before handling or machining sensitive components. Current research shows that voltages and spikes less than 0.5 volts are acceptable. However, an increasing number of extremely sensitive components require that soldering irons, solder extractors, test instruments and other equipment must never generate spikes greater than 0.3 volts.
IPC-7711 [5]Instructions for rework of Electronic circuits are provided, mimicking IPC-A-610-E.
Which measurements are important
Let’s examine the characteristics of the EOS signal caused by conducted EMI. Typically, the conducted transmit signal is a high energy signal, ie has a low output impedance and is capable of delivering high current. The reason is that generating interference on low-impedance power lines requires power, and only a truly low-impedance noise source can provide. Even fairly low voltage transients on power lines can be very dangerous due to the current capabilities of power lines.
Current is a better measure of EOS safety for sensitive equipment, as it is the current that causes actual damage (with very few exceptions). Also, the current capability of some devices and boards may be limited at high frequencies due to complex impedances. Therefore, the voltage measurement itself does not fully determine the current injection into the circuit.
Another factor that favors current measurements over voltage is that transients on power lines and ground are strong and can easily radiate a corresponding signal into the oscilloscope’s probe cable, distorting the voltage measurement. Due to a number of factors, including the lower impedance of the current probe arrangement, the injection of the radiation signal into the current probe is significantly less than the injection into the voltage probe. We will focus on the measurement of current.
A typical setup of the bench is shown in Figure 3. In the worst case, use a grounded metal plate instead of the PCB.Current using CT1 current probe from Tektronix[6]Measurements were made with a bandwidth of 1GHz. This probe has a conversion factor of 5mV/ma, which means that a current of 1mA is seen as 5mV on an oscilloscope.
There are many sources of noise in a manufacturing environment. Some of these are random, such as the transients that come with turning a typical heat gun or other device on and off. Others are periodic, synchronizing with the voltage waveform (50 or 60 Hz) on the mains. Periodic transients are caused by a variety of devices, including heaters, brightness controls for vision systems, and more. For data reproducibility, we focus on periodic signals. In the tests described below, easily reproducible noise produced by a common dimmer connected to a 60W bulb was used.
Figure 4 depicts such transients on the power line and the corresponding current flow between the tip and the assembly in the setup shown in Figure 3. As shown, the peak current from the tip (19.12mA) is significantly higher than the peak current allowed by ESDA. STM13.1-2000. It should be noted that in industrial environments, typical transient signals on power lines are often significantly higher than the signal C shown in Figure 4 see Figure 1 above.
Data from previously published sources corroborates the above data.Paper presented by Raytheon at the 2005 ESD Symposium[7]shows that the transient current at the tip of the soldering iron reaches 1000mA.
How noise is created on the tip of a soldering iron
While the tip of most professional grade soldering irons is grounded enough for DC and very low frequencies, at high frequencies things are quite different. Figure 5 shows how the soldering iron and table look at high frequencies. There are several factors at play (in no particular order of importance):
Noise on power lines induces corresponding noise on ground through capacitive and inductive coupling and leakage currents.
Switching power supplies (power supplies used in soldering irons to convert 120/250V to typical 24V) can be transparent to high frequency signals due to a number of factors, with parasitic capacitance being the main factor.Noise from the mains can therefore travel to the low voltage wiring of the iron’s heating element
The switching power supply inside the soldering iron may itself be a source of noise
The heating element of the iron is capacitively coupled to the tip of the soldering iron to transmit high frequency signals
Ground wires – from the mains to the iron’s power source, from the iron’s power source to the iron itself, and from the object being welded to the ground of the device – have complex impedances, both resistive and inductive.
If the voltage on the tip is the same as the voltage on the PCB or on the component being soldered, there won’t be any current flow. The grounding scheme of a professional soldering iron usually works well at DC and 50/60Hz frequencies. At high frequencies, it is nearly impossible to equalize the voltage between the tip and the component due to the complex impedance of the entire ground wire.Among other factors, this impedance can cause ground bounce[8]and phase shift, as well as resonance and ringing[9]. This is sometimes exacerbated by the fact that some plants have opted for a separate “ESD ground” C a different ground network that is ultimately connected to the facility ground. The long wires in these two ground nets lead to the soldering iron and the workbench, which greatly increases the voltage difference at high frequencies. Figure 6 shows the current flowing from the tip of the soldering iron in several cases with different distances between where the soldering iron is inserted and the ground of the workbench/PCB. As shown, the current difference reaches ~80%.
Soldering iron performance
Do all soldering irons create and/or reduce noise the same? How about a top soldering iron? If the tip of the soldering iron has current, does it mean that the soldering iron itself is defective or not suitable for use with sensitive components?
High frequency currents from professional grade properly installed soldering iron tips are not caused by the soldering iron itself, but by the complex device topology, wiring and operation of the device. The soldering iron is just one component of the soldering process, and no matter its quality, it cannot fundamentally solve the problem of the device itself. In short, if you have a good soldering iron, it’s doing its job. It is the user’s task to provide a secure EOS environment for the entire workbench where the iron is only one of the components.
Effects of transient signals on power lines and ground
If the source of the transient on the power line is known and can be removed without affecting the production process, the current reduction from the tip of the iron is relatively simple. However, the source is often unknown or cannot be removed. The only options left are ground management and filtering out transients on power lines and ground.
Grounding management
Rerouting ground connections and separating “noisy” grounds from clean grounds can help reduce unwanted current flow.This article[4]Recommended and explained techniques can help mitigate some noise issues. Specifically, low impedance to facility ground and separation between “noisy” and “quiet” grounds, and connecting soldering irons and workbenches to “quiet” grounds often result in lower level transients.
As shown in Figure 6, grounding as close as possible between the workbench and the soldering iron can significantly reduce current exposure during soldering.
However, ground management alone will not solve the noise problem satisfactorily because the source of the EMI cannot be eliminated, and there are still problematic signals in the soldering iron.
filter out noise
Unless the noise on the power lines and ground is greatly reduced, there is always the possibility of EOS exposure during the soldering process. There are mainly two cases:
a) Both ground and power lines have Noise b) The noise is only present on the ground, and there is no strong noise on the power line, i.e. the noise on the ground comes from other places in the factory
Power Line EMI Filters
These filters suppress noise on the power line and provide relatively clean power to the load (in our case, the soldering iron). Some EMI filters can also suppress noise in the ground wire.
Figure 7 shows the recommended application of a power line EMI filter using a soldering iron. It is important to connect the ground of the workbench or tool to the ground terminal of the filter, not the equipment ground. The C filter creates a quiet “EMI ecosystem” at its output. Figure 8 shows the tip current of a soldering iron optimized for use with OnFILTER’s APN515LG filter, which is optimized for the soldering process, with the same noise on the power line as in Figure 4. It can be seen that the current flowing from the tip of the soldering iron is negligible.
This requires specially designed filters optimized for welding process characteristics. For details, please refer to[9].
ground filter
If there is no appreciable noise on the power line, but there is noise on the ground propagating from elsewhere, a ground wire filter may be a good replacement for a power line filter that is less expensive than a more complex power line filter. Connect a ground wire filter between your equipment ground and the workbench/tool. To provide a safe, noise-free environment, proper selection of ground wire filters is required.
in conclusion
High-frequency signals on power lines and ground can cause high currents to flow into sensitive equipment during the welding process, resulting in electrical overstress and equipment damage. Proper analysis of the soldering environment, and any environment where conductive objects come into contact with sensitive equipment, and preventive and corrective action can improve yields and reduce EOS-induced failures.
Tokyo, Japan, March 31, 2020 – Renesas Electronics Corporation (TSE: 6723), a leading global supplier of semiconductor solutions, today announced the launch of the RX13T product group of 32-bit microcontrollers (MCUs) for consumer electronics and industrial High-efficiency inverter control of fans or pumps with compact motors, replacing the switch-type controls commonly used with conventional motors. These include energy-efficient factory equipment, such as drainage, water supply pumps, and cooling fans for data servers; and battery-operated household appliances that require longer runtimes, such as power tools, vacuum cleaners, and more.
The new RX13T product group integrates rich functions optimized for single motor inverter control, reduces the number of peripheral components on the chip, and provides low pin count packages, bringing higher efficiency and lower BOM cost for motor control.
The RX13T MCU is the first MCU (Note 1) to run at 32MHz with a floating point unit (FPU), and inherit the powerful functions of the RX product family, such as inverter control timer (MTU3), 12-bit A /D converter, Programmable Gain Amplifier (PGA) and data flash memory for brushless DC motor control on a single chip.
“The 32-bit RX product family has a rich product lineup and has been focusing on the motor control field since it was introduced to the market 10 years ago,” said Eiji Ito, vice president of the IoT Platform Business Unit at Renesas Electronics. Customers’ commitment to energy and cost efficiency in every type of motor control solution. On the 10th anniversary of the RX, we are committed to providing continued product innovation to serve customers and partners developing solutions using the RX product family .”
The RX13T product group is the first in the RX product family to be offered in the compact 32-pin LQFP and 48-pin LFQFP packages. In addition, there are plans to release smaller 32-pin 5mm x 5mm and 48-pin 7mm x 7mm QFN package versions. It is highly compatible with existing products such as RX23T and RX24T in terms of inverter timer and pin assignment, and users can easily reuse existing hardware and software design resources.
Renesas comes with an RX13T CPU card as part of the development environment that supports 24V motor control evaluation kits (with motors). With the emulator function, the user does not need an additional on-chip debugging emulator, and can quickly start the evaluation by simply connecting the CPU card to the PC via a USB cable. In addition, motor control example code for sensorless vector control is provided, and Renesas Motor Workbench 2.0 motor control development support tools are supported to help developers achieve rapid evaluation and development of motor control applications.
Key features of the RX13T product group:
·RXv1 CPU core, 32 MHz operating frequency, performance up to 98.56 CoreMark (Note 2).
An on-chip FPU eliminates the need for overflow handling when performing fixed-point arithmetic operations and helps improve software code readability.
·Supports a wide power supply voltage from 2.7V to 5.5V; the support of 5V operating voltage can greatly improve the anti-noise performance.
· Contains MTU3 timer module for inverter control. The timer counter clock runs at the same frequency as the high-speed clock when the CPU is running, making it easy to generate complementary PWM outputs with dead time required for inverter control.
The sample-and-hold function of dedicated channels (for three channels) allows three-phase current values to be sampled simultaneously, eliminating the need for error correction and reducing the burden on software.
·With 128KB or 64KB on-chip code flash memory, 12KB on-chip SRAM, and 4KB on-chip data flash memory, no external EEPROM is required.
· Rich on-chip peripheral functions, such as three-channel PGA, three-channel comparator, and high-speed on-chip resonator (HOCO, ±1.0% accuracy), to reduce the need for peripheral components.
Support operating temperature range, -40°C to 85°C and -40°C to 105°C. Meet the growing demand for high temperature operation in industrial and consumer electronics.
Availability
The RX13T is available now, and prices vary by package, memory capacity, and pin count. The 32-pin QFP version with 64KB ROM is priced at $0.99 each in 10,000-unit quantities (price or availability is subject to change without notice).
Notes
(Note 1) Sourced from Renesas Electronics research data as of March 31, 2020.
(Note 2) CoreMark: A benchmark developed by the Embedded Microprocessor Benchmark Consortium (EEMBC) specifically to evaluate the performance of CPU cores; this value indicates operational capability.
Large screens are obviously the most mainstream trend at the moment.
As the trend of automobile intelligence intensifies, consumers’ expectations for automobiles have become more and more diverse. In this context, the vehicle-mounted Display screen, as the main human-computer interaction window, is also endowed with more functional requirements. So, what kind of display screen does the car in the era of Zhilian need?
Tesla showed everyone a clear path through the launch of the Model S: the big screen.
How big is it? 17 inches.
As soon as the car came out, it completely subverted the traditional perception of the majority of consumers about cars, and it also made many car designers amazed: the original car can still be built like this. Then, just as Apple subverted the traditional mobile phone industry, a revolution that subverted the traditional car display screen was started, and the car designers of major brands were out of control on the road of pursuing large screens.
From the 7-inch central control screen of the Audi A3 to the 8-inch touch screen of the Corolla, to the 10.25-inch central control screen of the Mercedes-Benz A-Class and Hyundai Festa, the large screen has become the standard configuration of new cars on the market. and has a tendency to further increase.
A typical example is the Byton M-Byte, which has a screen as large as 48 inches—the concept car is 49 inches, and this screen is the largest in-vehicle screen on a mass-produced car so far. So some people began to worry, will a large screen in front of the driver’s line of sight block the driver’s line of sight? Byton gave the answer. The position of the screen has been repeatedly demonstrated and will not affect the driver’s line of sight. In addition, the screen can also adjust the brightness according to the change of ambient light, and the specially designed content interface will not disturb the driver at all.
Image source: Byton
With the intensified trend of automobile intelligence, the penetration rate of large-size displays in new cars is also increasing. From the perspective of the market as a whole, vehicles with central control below 10 inches account for the largest proportion, reaching 75.62%, the 10-11-inch central control screen accounts for 16.87%, the 12-12.8 central control screen accounts for 6.03%, the 13-inch The proportion of the central control screen above is 0.31%.
In terms of sub-sectors, the size of the central control panel of foreign and independent brands both showed double-digit increases. Among them, the size of the central control panel of A-class cars is less than 10 inches, and the installation rate of joint venture brands is slightly higher than that of independent brands. In terms of vehicle price, the central control screen has gradually penetrated into the price range of 50,000 yuan in self-owned brand models, and the size of the central control screen is expected to continue to expand in the future.
Why is the big screen becoming the mainstream now? The most primitive application of the car display screen is to assist the driver in driving. The large screen can display the car navigation and entertainment functions more clearly, thus providing a better interactive experience for the driver and passengers.
In the longer run, with the rapid development of autonomous driving, the driver’s attention can be appropriately shifted, or even completely liberated from the driving task, so that there is time to better enjoy life in the car, such as watching movies and playing games , these functions need the support of the large screen, so that the occupants in the car can enjoy a more pleasant driving experience.
Of course, improving the quality is also the reason why many consumers choose new cars with large screens.
In addition to the big future car screen, how can it be changed?
When major car companies are swarming to assemble large screens in new cars, Visteon, as the world’s largest cockpit electronics supplier, has begun to find new breakthroughs. This time, they have set their sights on another trend of in-vehicle displays: curved screens.
Taiji Matsumoto, global product director of Visteon cockpit displays, said: “The market trend of cockpit displays will gradually shift from small flat rectangular screens to large curved screens.” With the professional capabilities in the field of display, it has launched a variety of advanced cockpit displays, such as curved multi-modal displays, curved OLED displays and the new VX (Visteon eXperience) display platform.
Among them, the curved multi-modal display is a display product that Visteon brings a seamless curved design to the advanced full digital cockpit experience. It is well integrated into the interior styling and provides an immersive visual experience.
The curved OLED display is a cockpit display with the same level of image quality as smartphones. Its high contrast ratio, high saturation and pure black display capability can bring users a new cockpit experience. The VX display screen has technical features such as touch feedback, force sensing, proximity sensing, on-screen knobs, handwriting recognition, and optical glass bonding, which can bring users a very intuitive and easy-to-use operating experience.
Image via: Visteon
It is worth mentioning that, in addition to Visteon, Bosch also launched a curved screen that can be used in automotive instruments as early as 2018, and successfully equipped it in production cars. It is understood that the curvature of the digital curved instrument panel developed by Bosch mimics the natural curvature of the human eye, so even at the edge of the screen, the driver can detect indicators and warning signals better than what is seen at home or in the office area. Curved monitors have more technical advantages.
In addition, Continental is also working on a similar technical reserve, with its new curved amoled screen with a wave design that makes it easier for drivers to use while driving. However, despite the unique creativity, these curved screens are currently more in the conceptual stage, and there are still many difficulties in mass production, such as cost issues.
In this regard, the relevant person in charge of Visteon said that from the perspective of the overall development of the cockpit curved display industry, even if Visteon does not vigorously develop the cockpit curved display, due to changes in market supply and gradual improvement in yield, the cost of the cockpit curved display will also decrease. , and then follow-up will greatly reduce the overall R&D and manufacturing costs. However, most of Visteon’s top car factory customers have an urgent need for cutting-edge display technology. Therefore, Visteon has improved the yield rate of optical bonding of curved screens with advanced technology and reasonable manufacturing process under the trend of the gradual decline of the overall curved glass cost. , further reducing the manufacturing cost of the overall cockpit curved display.
From large screens to curved screens, the creativity of car displays is getting more and more cool. We might as well imagine that in the future, the car display screen may have a more wonderful presentation method: no screen, just like in science fiction movies, driving information is directly displayed in the projection, and this technology has been applied.
For example, Bestune T77 adopts holographic projection technology, but the display form is to simulate virtual characters, providing services for users as a car assistant. In the future, as the technology matures, holographic projection technology is expected to gradually expand the scale of application in automobiles.
Or, with the intelligent development of various materials, future interior materials may replace some LCD screens, such as woven fabrics and wood.
But to achieve these cool effects, there is still a long way to go in technology.
[Introduction]From May 17th to 19th, 2022, the 10th China Electronic Information Expo will be held at the Shenzhen Convention and Exhibition Center. The exhibition provides a comprehensive exhibition and Display platform, including the latest technologies, products and services of the electronic information industry, providing cutting-edge information, development trends, and potential business opportunities for the entire industry chain, assisting major enterprises and industry platform brands to promote, all in CITE 2022.
Guangzhou Feihong semiconductor Co., Ltd. was established in 2007. It is a high-tech enterprise engaged in the design, production and sales of semiconductor devices. Feihong’s independent research and development, tape-out, and its own back-end packaging and testing bases: Feihong is committed to the production and development of high-quality triodes, MOS tubes, triode voltage regulators, Schottky and other products.
At present, Feihong brand has strong competitiveness and brand influence in the national market. The company’s main sales products: high, medium and low voltage (30-900V) MOSFET, three-terminal voltage regulator, IGBT, Schottky, triode, etc. High product quality: using advanced technology and equipment, and high-standard materials. Meets industrial-grade reliability standards and can be screened according to customer independent testing. Application-oriented setting high standards: Wafers and finished products are screened by strict standard testing to ensure product quality to meet market and industry application requirements.
In the production process of packaging products, halogen-free green environmental protection materials are preferred to meet ROHS and REACH certification. Strong avalanche capability, good heat dissipation performance and good consistency. The product line is complete, including triode/Schottky/full range of MOS/triode voltage regulator. Product application areas: switching power supply, energy storage inverter, high-end audio, electric vehicles, LED lighting, home appliances, lithium battery protection, motor controllers, etc. The company is now focusing on the development of field effect transistors (MOS), Schottky, and other products. This year, it will gradually improve the IGBT, VD-MOS, SGT-MOS and other product lines;
This year, Feihong will continue to strengthen its R&D strength and self-flow wafer capability on the basis of its own high-end back-end packaging. It will remain customer-oriented, strengthen product promotion, and contribute to the localization of semiconductor components for the majority of high-end users. Continue to enrich the product series, provide customers with multi-faceted product supply services, continue to cultivate product quality, and establish a reliable brand reputation.
Feihong believes that the partner that customers need is to provide a wide range of products, excellent technology, stable brand, and delivery time to maintain its competitiveness. Feihong is committed to establishing close cooperative relations with customers, assisting customers to achieve and maintain their status, focusing on product innovation, process integration and product development. Therefore, Feihong is not only a parts manufacturer, but also a long-term strategic partner that customers are looking for.
The 10th China Electronic Information Expo (CITE2022) will focus on smart home, smart terminal, 5G, artificial intelligence, Internet of Things, IC design, ultra-high-definition video, 3D glass cover, semiconductor display, AR/VR, AI+ digital twin , Robots, Big Data and Storage, Sensors, Consumer Electronics, Cross-border Ecology, Automotive Semiconductors, Unmanned Vehicles, Autonomous Driving, Internet of Vehicles, Fuel Cells, Charging Technology, Industrial Internet, Information Technology Application Innovation Products, Basic Components, Special Components and other popular majors, the exhibition area exceeds 100,000 square meters, there will be 1,800 exhibitors from around the world, and more than 100,000 professionals will participate. In the same period, more than 100 summit theme forums will be held, through a series of activities such as theme seminars, technical exchanges, solicitation and selection, and new product release, to promote the vigorous development of China’s electronic information industry.
