iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Recently, internationally renowned organizations ifixit and techinsights released the dismantling of Apple iPhone 13 pro. The semiconductor industry observation features are compiled as follows for readers to understand.

Ifixit said that although the regular and mini models have acquired some cool new technologies of this generation, the iPhone 13 Pro has acquired all of them. This is what it contains:

A15 Bionic SoC equipped with new 5-core GPU, 6-core CPU and 16-core neural engine

6.1 inches (2532 × 1170 pixels) Super Retina XDR OLED Display with ProMotion

A 12 MP triple camera system with ultra-wide-angle ((ƒ/1.8), wide-angle ((ƒ/1.5) and 3x telephoto ((ƒ/2.8)) cameras with LiDAR module.

6GB RAM and 128GB storage space (configurable up to 1TB)

Sub-6 GHz 5G (and millimeter wave on US models), 4×4 MIMO LTE, 2×2 MIMO 802.11ax Wi-Fi 6, Bluetooth 5.0, UWB and NFC

MagSafe 15W wireless charging

IP68 waterproof rating

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Compared with the 13 Pro Max, this 13 Pro is just suitable for our dismantling. But the important thing is not the size, but the interior! It is believed that the future iPhone will have built-in X-ray function as one of its 14 cameras.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

You can also see double-dose L-shaped batteries, which can take up every millimeter of space. We have also seen stabilizing magnets for image sensors, micro logic boards and some possibly smaller tactile engines?

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

From the appearance, this version looks a little swollen compared to last year’s model. The bulge of the camera is so large that the phone cannot be placed flat on a flat surface!

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

The 13 Pro inherits our favorite way of dismantling smartphones. The display turns off first, just like opening a book. A…a little sticky book. Inside, we immediately found some surprises-and some beautiful tags! It’s almost as if they were expecting us.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

But we think this phone should not be opened?

First, the digitizer and display cables seem to have joined forces. The upper sensor cable closes itself near the top (and it is thin and too short).

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

The Taptic Engine looks smaller than the 12 Pro’s, but it’s actually bigger, weighing 6.3 grams and 869.4 mm, respectively.3, While the weight of the 12 Pro is 4.8 grams and 764.27mm3.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

The earpiece speaker that was previously fixed on the back of the display is now located at the end of the motherboard, which simplifies screen replacement.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Unfortunately, this change makes the earpiece speaker replacement itself less interesting. You must now pull out the entire logic board to replace the damaged speaker. (It will be described in detail later!)

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Compared with the 12 Pro, the Notch™ on the 13 Pro is 20% narrower, thanks to the combination of Face ID’s flood illuminator and dot matrix projector into one module! (More on the back too! Notice a pattern?)

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Let’s take a look at Apple’s LiDAR module.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Unlike ordinary iPhones, this year’s Pro camera arrangement looks the same (and significantly more powerful than the 12 Pro’s array).

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

As shown in the picture below, the lens of the new phone is extending outward to get more light.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Then, we removed the speaker and Taptic Engine to get the battery!

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Compared with the 10.78 Wh store location in the iPhone 12 Pro (and non-Pro), this sturdy L cap is 11.97 Wh, but not as good as the standard 12.54 Wh rectangular battery.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

None of these three can compare with the 17.8 Wh behemoth in Xiaomi Mi 11, let alone Samsung…

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Through this dismantling, we can finally breathe a sigh of relief. Because some rumors said earlier that Apple’s new mobile phone does not want to be able to replace the battery. But we are happy to report to you that our early battery replacement tests were all successful!

Then, we took out this logic board.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Because ifixit’s internal chip part has not been released yet, let’s take a look at the previous disassembly of techinsights. According to what they said, in the Apple iPhone 13 Pro A2636 256GB version, they identified several different components inside the iPhone 13 Pro.

Among them, Apple continues to use self-developed chips including A15, audio codec and audio amplifier. And Qualcomm leads the victory of RF design. In addition, we look at some common design winners, including KIOXIA, NXP, STMicroelectronics, USI, Qorvo and Broadcom.

 iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Turning to the back, we also saw other chips.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

  

Looking at another logic board, we found other vendors.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

  

In the techinsights article, some preliminary interpretations of the Apple A15 chip were also made.

According to reports, iPhone13 Pro and iPhone13’s Apple A15 Bionic have the same Apple part number APL1W07. In its dismantled iPhone 13 Pro A2636 model, it is a package (PoP) with an A15 application processor and SK Hynix LPDDR4X SDRAM (H9HKNNNEDMMVHR-NEH), which may be 6GB. We will confirm the process node of the DRAM chip later. , And further analysis.

  iPhone 13 Pro’s strongest dismantling: the main internal chip exposure

Although Apple said that the GPU cores are different, the two A15 Bionic APL1W07 of the iPhone 13 Pro and the iPhone 13 have the same chip label TMMU71, and the chip size (chip edge) is the same: 8.58mmx12.55mm=107.68 mm?, compared with the previous A14 , The chip size increased by 22.82%.

iPhone 13 Pro’s strongest dismantling: the main internal chip exposureiPhone 13 Pro’s strongest dismantling: the main internal chip exposure

In the follow-up, we will see the further dismantling and cost comparison of mobile phones on these two websites, and the semiconductor industry observation will follow up and bring it to readers as soon as possible, so stay tuned.

 

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