Dialog Licenses Non-Volatile Resistive RAM Technology with GF 22FDX Platform for IoT and AI Applications

London, UK, Santa Clara, USA, 20 October 2020 – Dialog semiconductor (Deutsche Börse), a leading provider of battery and power management, Wi-Fi, Bluetooth Low Energy (BLE), industrial edge computing solutions Code: DLG) and GLOBALFOUNDRIES®, the world’s leading specialty process semiconductor foundry, jointly announced today that they have reached an agreement for Dialog to license conductive bridge RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive RAM (ReRAM)-based technology was pioneered by Adesto Technologies, which Dialog Semiconductor acquired in 2020. GF will initially offer Dialog’s CBRAM as an embedded non-volatile memory (NVM) option on its 22FDX® platform, with plans to expand the technology to other platforms later.

Dialog’s exclusive and production-proven CBRAM technology is a low-power NVM solution designed for a range of applications including Internet of Things (IoT), 5G connectivity, artificial intelligence (AI). Low power consumption, high read/write speeds, lower manufacturing costs, and tolerance to harsh environments make CBRAM ideal for consumer, medical, and specific industrial and automotive applications. In addition, CBRAM technology provides cost-effective embedded NVM for advanced technology nodes required by products in these markets.

Mark Tyndall, senior vice president of corporate development and general manager of the Industrial Mixed-Signal Business Unit at Dialog Semiconductor, said: “CBRAM is one of Adesto’s outstanding signature memory technologies, and the addition of this technology to Dialog’s product portfolio is of strategic importance. GF’s licensing cooperation is a testament to the speed at which Dialog and Adesto can do business after the integration. Looking ahead, I am very confident in our strong partnership with GF. This licensing agreement not only provides the industry with state-of-the-art technology, but also This provides an opportunity for Dialog to adopt advanced CBRAM technology in the next generation of system-on-chip (SoC).”

“Our partnership with Dialog underscores GF’s commitment to investing in areas that further differentiate and add value to our customers,” said Mike Hogan, senior vice president and general manager of GF’s Automotive, Industrial and Multimarket Business Units. ReRAM technology is a great addition to our leading line of eNVM solutions. This memory solution, combined with our FDX platform, will help our customers push the boundaries of technology and deliver next-generation secure IoT and edge AI applications.”

Dialog’s CBRAM technology overcomes the integration and reliability challenges common to ReRAM, providing reliable and low-cost embedded memory while retaining the low-voltage operation capabilities of ReRAM. This means lower power read and write operations than standard embedded flash can be achieved.

CBRAM will be available to GF customers as an embedded NVM option on the 22FDX platform in 2022. Through IP customization, customers can modify CBRAM cells to optimize their SoC designs, improve security, or tune the cells to suit new applications. In addition, CBRAM, as a “back-end” technology, can be integrated into other technology nodes with relative ease.

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