The world’s strongest glass cleaning robot: weight 915 grams, price 2100 yuan

Recently, the robot company HOBOT launched a brand new household window cleaning robot, the robot model is HOBOT-388. HOBOT-388 measures 29.5cm x 14.8cm x 9.5cm, weighs only 915 grams, and looks like a large mouse.

The current crowdfunding price of HOBOT-388 is 33,366 yen, or about 2,143 yuan.

Its core function is that it can be remotely controlled through a mobile phone and automatically wipe the glass. This product is dedicated to solving the problem of outdoor glass cleaning for families living in high-rise buildings.

There are 2 vacuum motors inside the HOBOT-388, which can be attached to the smooth glass surface and controlled by a mobile phone to move freely. HOBOT-388 is equipped with an ultrasonic water spray nozzle, which can atomize water into a 15-micron water mist, which is evenly sprinkled on the glass.

The glass is then quickly cleaned indoors or outdoors via two wheels fitted with a microfiber cleaning cloth. Similar to the sweeping robot, it can also independently plan the cleaning route through the built-in AI algorithm.

In order to prevent HOBOT-388 from accidentally slipping, it is also equipped with a 4.5-meter-long safety wire, as well as a 5-meter-long power cable. It can be controlled remotely via its own remote or smartphone.

The HOBOT-388 window cleaning robot is adsorbed on the smooth surface by the suction generated by the built-in motor. The suction force can reach up to 5kg, which is enough for the robot to move stably on the glass surface. In addition to glass, the robot can also be used on other smooth surfaces.

The Links:   CM1200HB-66H PM800HSA120 LCD-DISPLAY

[Review and Outlook]Expanding its own team + keeping up with customer needs, Avnet fully deploys seven areas of “new infrastructure”

2020 is destined to be an extraordinary year. The sudden outbreak of the new crown epidemic disrupted our normal study, life and work, and also caused a huge impact on the global economy. At the same time, “new infrastructure” has been frequently screened this year and has become a “hot word” in China’s economy.

On April 20, the National Development and Reform Commission for the first time clarified the scope of new infrastructure, including information infrastructure, integration infrastructure, and innovation infrastructure. On May 22, the “new infrastructure” was officially written into the government work report. The “Report” proposes: “Strengthen the construction of new infrastructure, develop a new generation of information networks, expand 5G applications, build charging piles, promote new energy vehicles, stimulate new consumer demand, and help industrial upgrading.” “Infrastructure” mainly includes seven major fields: 5G infrastructure, UHV, intercity high-speed railway and urban rail transit, new energy vehicle charging pile, big data center, artificial intelligence, industrial Internet.

Recently, “Application of Electronic Technology” invited a number of semiconductor manufacturers with a wide range of representatives to review 2020 and look forward to 2021 on the topic of “new infrastructure”!

Ms. Dong Hua, Vice President of Sales and Supplier Management, Avnet China

The “New Infrastructure” strategy brings once-in-a-lifetime development opportunities to the semiconductor industry

Ms. Dong Hua, Vice President of Sales and Supplier Management of Avnet China, said: “The semiconductor industry is the cornerstone of the development of modern society. All fields involved in the new infrastructure are inseparable from the support of semiconductor, a fundamental and leading industry.”

The new infrastructure mainly includes three aspects: information infrastructure, integrated infrastructure and innovative infrastructure construction, which specifically cover 5G, industrial Internet, artificial intelligence, big data, intelligent transportation infrastructure, and smart energy infrastructure, etc. important application areas.

With the in-depth advancement of new infrastructure and the continuous release of digital dividends, industries such as 5G communications, UHV, intercity high-speed railways, new energy vehicle charging piles, big data centers, artificial intelligence, and industrial Internet of Things will accelerate their rise. Bringing once-in-a-lifetime development opportunities to the semiconductor industry.

“New infrastructure” needs continuous investment, Avnet plans to expand key teams

Dong Hua said that the core concept of new infrastructure is technological innovation, enabling new technologies to empower all walks of life and inject new momentum into economic development. Driven by the demand for new infrastructure, applications including 5G networks and 5G mobile phones, industrial automation, robotics applications, IoT and smart IoT, and new energy vehicles will usher in huge business opportunities.

Avnet actively pays attention to the investment direction encouraged by government policies, and then cooperates with the original factory to select competitive products and mainly promote them to the target market. China’s new infrastructure policy has also attracted the attention of the original factory. Avnet seized the major development opportunities brought by the “new infrastructure” and quickly created synergy with the original factory. Avnet’s R&D and marketing departments have conducted in-depth analysis of new infrastructure industry applications and business prospects. Since many applications span multiple product lines, Avnet has also intensively arranged business training for sales personnel to help them improve their understanding of the target market. understanding and service capabilities. It is particularly worth emphasizing that new infrastructure requires continuous investment. Avnet has also predicted the expected increase in the number of customers and business scale, and has corresponding expansion plans for the sales and R&D departments, especially the FAE/product engineer team. Avnet is good at providing customers with technical value-added services and overall solutions. This part of the investment is especially important for its original factories and customers.

5G applications have a huge pulling effect on the semiconductor industry

According to Dong Hua’s analysis, 5G is the leader of new infrastructure. The government’s strong support for 5G networks has provided a broad space for many 5G-based applications, such as the Internet of Things, big data, AI, Internet of Vehicles, and smart cities. And application scenarios such as autonomous driving will accelerate in the 5G environment, driving the market demand for electronic components, which will have a huge pulling effect on the semiconductor industry.

Avnet is“New Infrastructure”Layout in specific areas

Avnet has deployed in seven major fields including big data centers involved in “new infrastructure”, charging piles for new energy vehicles, industrial Internet of Things, artificial intelligence, intercity rail transit, UHV, and 5G base station construction. Dong Hua said: “In the future, Avnet will continue to deploy, provide support to customers in key areas of new infrastructure, help them design cutting-edge high-tech products and bring them to market quickly.”

·artificial intelligence

Taking artificial intelligence as an example, the AI ​​inference market including data center inference and edge inference is growing significantly. Based on this trend, Avnet has joined hands with very important partners in the industry to launch an artificial intelligence development platform with low The characteristics of latency, high performance, high flexibility and high scalability allow customers to freely develop their own products, which are efficient, fast and easy to use. Based on this development platform, Avnet has also launched an edge AI server, which achieves scalability in terms of architecture, can perform critical low-latency analysis at the edge, and has great advantages in speed and power consumption. An AI solution with the fastest speed and lowest power consumption in the industry.

At the same time, in response to the rapid growth of the inference market, Avnet also signed a cooperation agreement with Mipsology, an innovative company in the field of AI software, through their breakthrough in-depth learning inference acceleration solutions, to help customers directly use GPU solutions in FPGAs. on the programmed device. To sum up, based on Avnet’s AI development platform, servers and Mipsology’s deep learning inference solutions, downstream customers can get a complete set of AI solutions, including hardware, software, system integration, application development, and design chain support. On the one hand, the cycle of product design and application landing has been greatly accelerated.

5G

In terms of 5G, Avnet not only provides supply chain support for the construction of the entire 5G network, but at the same time, in order to cope with the rich application scenarios spawned by the 5G network, in addition to providing a development platform, Avnet also launched a 4-inch fully integrated software and hardware. *5-inch 5G module, integrated with processing chip, RoF analog interface, etc., which is convenient for customers to quickly implement landing applications.

·Industrial Internet of Things

In terms of the Industrial Internet of Things, Avnet and Microsoft have jointly launched the IoTConnect solution, which is based on the PaaS (Platform as a Service) model, which supports device communication, management, data storage, and the use and creation of the entire application. Have strong network security protocols. Through IoTConnect, users can realize end-to-end connection, and manage, store, process, monitor, security and other services from cloud to end.

According to Dong Hua, in addition to AI, 5G, and the Industrial Internet, Avnet has been deploying high-speed rail, power grids and other fields very early to accurately understand the actual needs of customers, explore and research with customers, and accompany customers throughout the design supply chain to help customers. Solve supply chain problems.

The Links:   MCC720-18 BSM150GB170DLC THE IC INFO

PIC microcontroller controls clock chip DS1302 assembler

#INCLUDE
CBLOCK 20H
SEC; sec
MIN ; points
HOU; hours
DATE ; date
MON ; month
DAY ; day
YERR ; year
DDD ; write enable bit
TIME_TX ; 1302 send register
TIME_RX ; 1302 receive register
COUNT1 ;
COUNT2;
DELAY1
DELAY2
ENDC
********************************
; ; 1302 subroutine description
; ;********************************
; DS1302INI ; 1302 initialization, first disable RST, set the charging mode
; SET_TIME ; send 7 data set time at a time, including write enable register, 8 data
; GET_TIME ; Receive 7 data Display time at a time
; TIME_WRITE_1; write 1302 bytes at a time
; TIME_READ_1 ; Receive data one byte at a time
; ;******* 1302 Definition **************
; ;********************************
#DEFINE I_O PORTC,7 ;1302I_O
#DEFINE SCLK PORTC, 6 ; 1302 clock
#DEFINE RST PORTA,0 ;1302 enable bit
#DEFINE RX_ADD 40H ; save the accepted 7 data
#DEFINE TX_ADD 20H; start saving 7 time data to be written
BANK1 MACRO
BSF STATUS,RP0
ENDM
BANK0 MACRO
BCF STATUS,RP0
ENDM

ORG 000H
NOP
GOTO MAIN
MAIN

CALL CLR_RAM Clear RAN
CALL PORT_INI port definition
CALL DS1302_INI
CALL SET_TIME writes 7 time data at a time
CALL GET_TIME ; read back 7 time data at a time
GOTO $

;; Write seconds, you can write any 7 time data, single byte
MOVLW B’10000000′
MOVWF TIME_TX
BSF RST
CALL TIME_WRITE_1
MOVLW B’00100101′
MOVWF TIME_TX
CALL TIME_WRITE_1
BCF RST

Countdown, can read any 7 times, single byte

MOVLW B’10000001′
MOVWF TIME_TX
BSF RST
CALL TIME_WRITE_1
CALL TIME_READ_1
BCF RST

GOTO $

: subroutine

****************************************************
; DS1302_INI
; Function: Initialize 1302, disable RST first, allow write enable
;************************************************ *
DS1302_INI
BCF SCLK
BCF RST ; disable first
MOVLW B’10001110′ ; write enable register
MOVWF TIME_TX
BSF RST
CALL TIME_WRITE_1
MOVLW B’0′ ; allow write enable
MOVWF TIME_TX
CALL TIME_WRITE_1; send one byte of data
BCF RST

;Set the charging method

not set
RETURN

;************************************************ *
; SET_TIME
; Function: Input 7 data at a time to set the time at one time, and enable the write register at the same time
; Burst mode write, must write 8 data, not 7
; INPUT: The 8 data to be set have been written into the 8 bytes starting from TIME_TX_ADD
;************************************************ *
SET_TIME
MOVLW B’10111110′ ; flag bit
MOVWF TIME_TX
BSF RST
CALL TIME_WRITE_1
;TIME_WRITE_8 ;Send 8 data
MOVLW TIME_TX_ADD ; The starting address of sending data
MOVWF FSR
MOVLW D’8′
MOVWF COUNT2
TW1
MOVF INDF,W
MOVWF TIME_TX
CALL TIME_WRITE_1
INCF FSR,F
DECFSZ COUNT2,F
GOTO TW1
BCF RST
RETURN
;************************************************
; GET_TIME
; Function: accept 7 bytes of time data at a time, read in burst mode
; INPUT:NONE
; OUTPUT: Save 7 time data in 7 registers starting from TIME_RX_ADD
;************************************************
GET_TIME
MOVLW B’10111111′
MOVWF TIME_TX
BSF RST
CALL TIME_WRITE_1
;TIME_READ_7 ;Receive 7 data
MOVLW TIME_RX_ADD ; start address for saving data
MOVWF FSR
MOVLW D’7′
MOVWF COUNT2
TR2
CALL TIME_READ_1
MOVF TIME_RX,W
MOVWF INDF
INCF FSR,F
DECFSZ COUNT2,F
GOTO TR2
BCF RST
RETURN
;************************************************
; TIME_WRITE_1
; Role: send one byte of data at a time for sending 1302
; control word or send a data
; INPUT: TIME_TX
;************************************************
TIME_WRITE_1
MOVLW D’8′
MOVWF COUNT1
TLOP
BCF I_O ; initial value is low level
BCF SCLK
BTFSC TIME_TX,0
BSF I_O
RRF TIME_TX,F
BSF SCLK ; high level send data
DECFSZ COUNT1,F
GOTO TLOP
BCF SCLK ; resume
RETURN
;************************************************
; TIME_READ_1
; Function: read 1302 bytes of data
; INPUT: NONE
; OUTPUT: The received data is stored in TIME_RX
; Principle: Receive data on the falling edge of SCLK, the low byte is first, according to the I_O
; The level of the level is shifted right with and without carry.
;************************************************
TIME_READ_1
BANK1
BSF TRISC,7 ;I_O IS INPUT
BANK0
MOVLW D’8′
MOVWF COUNT1 ; read 8 bytes
TR1
BCF SCLK ; falling edge read
BCF STATUS,C
BTFSC I_O
BSF STATUS,C
RRF TIME_RX,F
BSF SCLK ; resume high
DECFSZ COUNT1,F
GOTO TR1
BANK1
BCF TRISC,7 ;OUTPUT
BANK0
BCF SCLK ; resume
RETURN
NOP

PORT_INI
BANK1
MOVLW B’00000000′
MOVWF TRISC
MOVLW B’0′
MOVWF TRISB
MOVLW B’00000111′
MOVWF ADCON1
MOVLW B’00000000′
MOVWF TRISA
BANK0
MOVLW 18H
MOVWF 20H
MOVLW 19H
MOVWF 21H
MOVLW 05H
MOVWF 22H
MOVLW 13H
MOVWF 23H
MOVLW 14H
MOVWF 24H
MOVLW 15H
MOVWF 25H
MOVLW 16H
MOVWF 26H
RETURN
CLR_RAM
MOVLW 20H
MOVWF FSR
LOOP
CLRF INDF
INCF FSR,F
BTFSS FSR,7
GOTO LOOP ; clear 32
RETURN
END

The Links:   EP2SGX60EF1152C4N CM800HA-34H

“Qualcomm, MediaTek, and Ziguang Zhanrui” under the 5G chip are three pillars

Recently, the data research organization Counterpoint released the industry report “5G Opens a New Round of Mobile Network Migration, Global Baseband Manufacturers Usher in a New Journey”, expounding that mobile phone baseband/chip manufacturers welcome the wave of smartphone upgrades spawned by 5G’s reshaping of the terminal track. .

The report pointed out that 5G not only “brings flying” 5G mobile phones, but also some segments that are easily ignored by the industry, and new market opportunities will emerge due to the large-scale commercial use of 5G.

As of the end of June, more than 400,000 5G base stations have been constructed and opened in China, 197 5G terminals have obtained network access licenses, and 5G mobile phone shipments this year have reached 86.23 million units. Counterpoint pointed out that in the second quarter of this year, 33% of smartphones sold in China supported 5G, leading the world.

The Counterpoint report predicts that 5G smartphone shipments are expected to reach 1.16 billion units in 2024, with a five-year compound annual growth rate of 137%, accounting for 70% of overall mobile phone shipments. From the perspective of chip suppliers, 5G Chips are more complex and the threshold is higher. At present, the independent chip suppliers are still the “troika” of Qualcomm, MediaTek, and Ziguang Zhanrui.

The report analyzes that Qualcomm has an end-to-end product portfolio from SoCs, baseband modems to transceivers, radio frequency front-ends (RFFEs), to antennas, and supports both sub-6GHz and mmWave frequency bands, whether it is platform features or commercial models. In terms of quantity, Qualcomm is ahead of its competitors, accounting for more than half of the 5G market share.

MediaTek is also actively deploying 5G and continuously expanding its 5G Dimensity product line. At present, MediaTek has launched 5G chips such as Dimensity 1000/1000plus, Dimensity 800/820, and Dimensity 720.

The same is true for UNISOC. In 2019, it released the 5G multi-mode baseband chip V510, and in 2020, it released the 5G SoC platform Huben T7520 using a 6nm process, etc., to fully develop the 5G market.

The Links:   PHT40016 FRS400CA120 LCD-DISPLAY

Turck’s first explosion-proof Ethernet gateway for zone 2 for excom I/O systems

Turck’s first Ethernet gateway for the excom I/O system opens the door to digitalization and Industry 4.0 for the process industry. Condition monitoring and predictive maintenance can now be carried out quickly and easily, as all process data can now reach the IT system quickly via parallel communication for analysis and evaluation. Controllers and control systems are completely unaffected and unauthorized access can also be avoided. With its compact design, the system is not only suitable for installation in the field, but also in the control room.

The long innovation cycle in the field of process automation requires engineers to design with future installations and future automation technologies in mind. This is especially true for new facilities. And there is no doubt that in-depth diagnostics of processes and instruments will become increasingly important in the future.

In order to make efficient use of all the additional data, system planners need to consider all aspects when designing an automation system. Although the use of this data is not currently mandated, many factories that have been operating for decades have begun to integrate data channels and continue to optimize them. Anyone working on a real project must ensure that their automation systems support the NAMUR-defined Monitoring and Optimization (M+O).

In the monitoring and optimization of process data, dual Ethernet interfaces enable parallel data access; redundant gateways ensure high availability.

Fieldbus Bottleneck

In traditional fieldbus solutions, whether using Profibus DP, Profibus PA or Foundation Fieldbus solutions, the bus technology is the bottleneck for implementing various diagnostic functions, which are not performed by the sensor itself, but by outside the control system. The parent system executes. In other words, although HART, Profibus PA or FF fieldbus devices can already generate and transmit large amounts of data today, due to limited bandwidth (31.25 Kbit/s for Profibus PA and FF fieldbus, 1.5 Mbit/s for Profibus DP IS) , many of which are only used when equipment is replaced or calibrated. This big data is never used for process optimization, or early detection of issues such as wear and contamination (i.e. predictive maintenance).

Monitoring and optimization with parallel data

NAMUR identified this need and introduced the NAMUR Open Architecture (NOA) concept: NOA can establish independent data channels in parallel with the automation pyramid, without any impact on the field device, I/O system and control system level. Data can be transmitted and analyzed below the control system level via parallel channels, independently of conventional automation technology. Compared with operational technologies in the field of factory automation and control, the parallel channel approach can achieve faster innovation iterations of IT systems, which benefits significantly. In addition, this architecture precludes external access to the control system.

Ethernet for excom pioneers parallel access to process data

With the first Zone 2 Ethernet gateway, Turck has pioneered the possibility of parallel data access and high availability of excom I/O systems used in explosion-proof areas. In the autumn of 2019, automation specialist Turck has already launched the excom Ethernet gateway for non-Ex areas, but this time the gateway is designed for Ex Zone 2. The excom system has I/O modules with various input, output or other types of signals, and the replacement of the gateway module will not have any impact on the backplane and I/O modules. Intrinsically safe equipment in zone 0 can be directly connected to excom in zone 2 to process its input and output signals. This Zone 2 explosion proof Ethernet gateway can be installed directly on an existing backplane for use with other I/O modules.

In today’s new projects, excom for Ethernet communication can already be used in automation systems for parallel data access. However, in retrofit projects, most end users may only need to consider converting traditional signal transmission methods to Ethernet communication methods when they need to upgrade their control systems. In different application scenarios, excom can be used as an alternative Ethernet communication solution for parallel data access while retaining existing field instrumentation equipment. The excom can be installed either in the control room or in Zone 2 for use as remote I/O.

Space-saving installation in the control room

Since excom has integrated intrinsically safe isolation, there is no need to install an isolation barrier in the control cabinet. The original I/O module can be replaced with the excom system, and the field instrument signal can be received. This solution will be more compact than the traditional I/O and isolation barrier solution. Compared to other I/O systems with integrated explosion-proof isolation, Turck’s excom modules also generally require less space, which is an advantage in retrofit projects or modular process plants.

The Links:   SKKH330-16E ETL81-050 IGBTMODULE

2020 Feiteng Ecological Partner Conference was grandly held in Tianjin

On December 29th, the 2020 Feiteng Ecological Partner Conference was grandly held at the InterContinental Hotel in Yujiapu, Tianjin. The theme of the conference is “The New Ecology of Chip Technology”. More than 1,500 people and more than 200 companies including well-known academicians, government leaders, industry experts and industry associations, user units, software and hardware manufacturers and system integrators participated in the conference.

2020 is a year of explosive growth in the demand for new infrastructure markets. The scale of applications such as the Internet of Everything, artificial intelligence, 5G communications, and digital cities has risen. Based on the underlying core computing power, the coordinated development and security of the information industry covering from end to cloud are available. The system construction of trust has become the development direction of the computing industry in the future.

As a leading independent core chip provider in China, Feiteng adheres to the development concept of “independent innovation of core technology, industrial ecology, openness and alliance”, continuously improves product lineage, provides industry partners with a mature and complete solution system and security architecture, and joins hands with upstream and downstream manufacturers to build Create a huge, open and active industrial ecology. In order to showcase the progress and innovation achievements made in the past year, attract more partners to seek industrial development and help new infrastructure, Feiteng sincerely invites partners from all walks of life to share the new industry value of “core” computing power, and look forward to the new possibilities of the industry in the new era.

Yin Xiaofeng, deputy head of Tianjin Binhai New Area People’s Government, said in his speech: “Binhai New Area is at the forefront in the field of technological innovation, including Tianhe-1, which won the international supercomputing crown for the first time, Feiteng CPU, Kirin operating system, Great Wall Computer, Dawning Computer, 360 Software, Database, Ziguang Cloud, Kingsoft Cloud and a large number of leading independent innovation enterprises in the industry.” Driven by the wave of new infrastructure construction, Binhai New Area will become an important source of independent innovation and the main source of original innovation. .

Yin Xiaofeng, full-time deputy director of Tianjin Free Trade Zone Management Committee and deputy head of Binhai New Area

Chen Ximing, member of the party group and deputy general manager of China Electronics Information Industry Group Co., Ltd., mentioned in his speech, “The Fifth Plenary Session of the 19th Central Committee of the Communist Party of China proposed to adhere to the core position of innovation in the overall situation of my country’s modernization construction, and to regard scientific and technological self-reliance and self-improvement as the core of national development. Strategic support, and put it at the top of each planning task for special chapter deployment.” As an important part of high-end general-purpose Chips, CPU chips are the key to insisting on technological self-reliance and eliminating the chronic disease of “lack of cores”. The information system occupies an extremely core position and is the basis for the efficient and safe operation of office and business systems.

Chen Ximing, member of the party group and deputy general manager of China Electronics Information Industry Group Co., Ltd.

Dr. Dou Qiang, general manager of Feiteng Company, gave a keynote speech titled “Boundless Oceans and Cores, Gathering Potential to Soar Together”, and shared the ecological construction and application results of Feiteng CPU in 2020. According to reports, Feiteng currently has about 1,600 partners, has completed the design and support of 924 projects from 423 partners, and completed adaptation optimization and certification with 2,557 software from 851 manufacturers. A joint solution for each industry, covering telecommunications, finance, energy, transportation, medical care, digital city, industrial manufacturing and other industries, while coupling cloud computing, big data, 5G, AI, blockchain and other technical directions to help the industry informatization construction Rapid development provides “core” kinetic energy.

Dou Qiang, General Manager of Feiteng Company

In addition, Feiteng achieved rapid revenue growth in 2020, with annual sales exceeding 1.5 million tablets and annual revenue exceeding 1.3 billion yuan. Products based on Feiteng’s CPU platform have been widely used in my country’s party and government office systems, key industry business systems, cloud computing, big data, and important fields related to national security, national economy and people’s livelihood, such as finance, energy and rail transit. Feiteng is also focusing on school-enterprise cooperation and technical talent training this year, and officially released the Feiteng training certification system, which aims to cultivate talents for government ministries, industry users, industry associations, integrators, machine manufacturers, board card manufacturers and other enterprise partners. , and jointly build a new ecology of information talents.

Feiteng ecological partners from Huaneng, Baidu, Sunsea, Lenovo, Pactera, Tianrongxin and AsiaInfo delivered keynote speeches, detailing the application of Feiteng CPU in power, artificial intelligence, communication, finance, government affairs and big data, etc. application in the field.

The heavy equipment has been completed, and the success is outstanding

The conference released a new product, Tengrui D2000. According to Guo Yufeng, deputy general manager of Feiteng, Tengrui D2000 integrates 8 high-performance processor cores FTC663 independently developed by Feiteng, compatible with 64-bit ARMv8 instruction set, main frequency 2.3~2.6GHz, TDP power consumption 25W, support Feiteng’s self-defined processor security architecture standard PSPA 1.0 meets the requirements for performance, security and trustworthiness in more complex application scenarios.

Compared with the previous generation product, the performance of Tengrui D2000 has greatly improved, and it is compatible with the previous generation product FT-2000/4 pins. Customers can realize the in-situ replacement of the existing system, which is seamlessly compatible; the SPECint score is 97 .45, nearly twice the original value.

Various types of terminal products based on Tengrui D2000, such as desktops, notebooks, all-in-one computers, industrial computers, and network security equipment, will be launched in Q1 2021.

Empowering the ecology, the main force of Xinchuang

The meeting also released several projects such as Feiteng CPU-based server product group and embedded product group, artificial intelligence ecological joint laboratory, new infrastructure comprehensive service guarantee platform and training certification system.

15 domestic manufacturers including China Great Wall, Inspur, Tongfang and Beijing Institute of Computer Technology and Application (see the list at the bottom of the article for the full list) released multi-socket server product groups based on Tengyun S2500, Ruijie, Great Wall Finance, CLP Intelligent Hehanwei and other 10 domestic manufacturers (see the list at the bottom of the article for the full list) have released embedded product groups based on Feiteng CPUs. These products will be used in domestic government affairs and corporate office, cloud computing, data centers, finance and other fields. The product performance, energy consumption and degree of autonomy have obvious advantages in products of the same type, and can effectively support the transformation and upgrading of the national core information system.

Feiteng National New Infrastructure Comprehensive Service Guarantee Platform is the first national service guarantee platform led by chip manufacturers in China. Provide exclusive services such as training and technical support. At the meeting, 13 integrators such as Chinasoft, Inspur, China System and Taiji Computer (see the list at the bottom of the article for the full list) signed a cooperation agreement with Feiteng and became the first strategic partner of Feiteng’s new infrastructure service guarantee platform to jointly serve new infrastructure and Transformation and upgrading of information systems in various industries.

The conference also held the Feiteng education ecological release link. Feiteng officially released the training certification system this year, which has been jointly certified by the industry and information talents and Feiteng. Feiteng and the Ministry of Industry and Information Technology will be committed to cultivating a group of management elites and specialized talents who can deeply understand and skillfully control the related technologies of the information industry chain through professional and systematic training, and provide a solid talent guarantee for the national information industry. 15 projects from 11 universities including Tianjin University, Hunan University, Xi’an Jiaotong University and Sun Yat-Sen University (see the list at the bottom of the article for the full list) were held at the meeting. Project” contract.

In order to better empower ecological partners, Feiteng has reached in-depth cooperation with many leading artificial intelligence companies to jointly build a full-stack Feiteng artificial intelligence ecological joint laboratory. At the meeting, Feiteng and 25 companies including Kylin Software, Bitmain, Baidu and Taiji (see the list at the bottom of the article for the full list) jointly released the Feiteng Artificial Intelligence Ecological Joint Laboratory to jointly promote the implementation of Feiteng CPU-based AI solutions and accelerate deployment The AI ​​ecosystem enables AI capabilities to be better and faster in thousands of industries.

The meeting awarded the plaques of “Feiteng New Partners in 2020” to 36 new companies including Great Wall Chaoyun, Shanxi Baixin, Digital China, and Emdoor (see the list at the bottom of the article for the full list).

Four sub-forums were held at the same time, with topics covering e-government, financial telecommunications, industrial control and informatization, artificial intelligence and other fields. Feiteng brings a number of partners to share typical cases and exchange the innovation achievements and development plans of ecological partners.

The exhibition area showcased the applications and solutions of more than 150 enterprises based on Feiteng CPU, showing the broad application prospects, excellent performance and active and open ecology of Feiteng’s full-spectrum products.

The success of a building is not the talent of a single tree; the vastness of the sea is the return of thousands of streams. The research and development of the core independent CPU and the construction of the ecology not only require the energy of the day and night, but also the long-term patience and openness of mind, and use a hundred schools of thought to overcome difficulties and seek development. In the future, Feiteng will continue to implement the concept of independent innovation of core technologies, make steady progress, and cooperate with more ecological partners to help the development of my country’s independent advanced, safe and controllable information industry!

2020 Feiteng Ecological Partner Conference

Joint release link manufacturers list

Tengyun S2500-based multi-socket server product group released

1.China Great Wall Technology Group Co., Ltd.

2.Inspur Electronic Information Industry Co., Ltd.

3.Tongfang Computer Co., Ltd.

4.Beijing Institute of Computer Technology and Application

5.Dawning Information Industry Co., Ltd.

6.ZTE Corporation

7.Unisplendour Hengyue Technology Co., Ltd.

8.Shenzhen Baode Computer System Co., Ltd.

9.Lenovo Changfeng Technology (Beijing) Co., Ltd.

10.Beyond Technology Co., Ltd.

11.Zhongke Tenglong Information Technology Co., Ltd.

12.Zhejiang Dahua Technology Co., Ltd.

13.Great Wall Chaoyun (Beijing) Technology Co., Ltd.

14.Guangzhou Qixi Computer Co., Ltd.

15.Guangzhou Wuzhou Technology Co., Ltd.

Feiteng CPU-based embedded product group released

1.Ruijie Networks Co., Ltd.

2.Hunan Great Wall Information and Financial Equipment Co., Ltd.

3.CLP Intelligent Technology Co., Ltd.

4.Guangdong Hanwei Information Technology Co., Ltd.

5.Hengwei Technology (Shanghai) Co., Ltd.

6.Lanju Industrial (Chibi) Technology Co., Ltd.

7.Guangzhou High Energy Computer Technology Co., Ltd.

8.Beijing Leyan Technology Co., Ltd.

9.Guangzhou Radio and Television Express Financial Electronics Co., Ltd.

10.Fujian Shengteng Information Co., Ltd.

Feiteng New Infrastructure National Service Guarantee Platform Strategic Partner

1.China Software and Technology Service Co., Ltd.

2.Inspur Group Co., Ltd.

3.China electronic System Technology Co., Ltd.

4.Tai Chi Computer Co., Ltd.

5.Neusoft Group Co., Ltd.

6.Aerospace Information Co., Ltd.

7.China Mobile System Integration Co., Ltd.

8.Unicom System Integration Co., Ltd.

9.donghua software co., ltd.

10.Beijing Huayu Information Technology Co., Ltd.

11.Beijing Shenzhou Aerospace Software Technology Co., Ltd.

12.Shanghai Wanda Information System Co., Ltd.

13.Digital China System Integration Service Co., Ltd.

Feiteng Education Ecological Release Link Industry-University Cooperation Collaborative Education Project Signing Universities

1.Tianjin University

2.Tianjin University of Technology

3.Xi’an University of Posts

4.Xidian University

5.Xi’an Jiaotong University

6.Jilin University

7.Hunan University

8.Sun Yat-Sen University

9.University of Electronic Science and Technology of China

10.Harbin Institute of Technology

11.National Defense University

Member of the Board of Directors of Feiteng Artificial Intelligence Ecological Joint Laboratory

1.Kylin Software Co., Ltd.

2.Beijing Bitmain Technology Co., Ltd.

3.Beijing Baidu Netcom Technology Co., Ltd.

4.Tai Chi Computer Co., Ltd.

5.Hefei Xunfei Digital Technology Co., Ltd.

6.Lanju Industrial Technology Co., Ltd.

7.Shanghai Suiyuan Technology Co., Ltd.

8.Guangdong Hanwei Information Technology Co., Ltd.

9.Shenzhen Yuntian Lifei Technology Co., Ltd.

10.Shenzhen Kunyun Information Technology Co., Ltd.

11.Beijing Yunsi Changxiang Technology Co., Ltd.

12.Beijing Integrated Circuit Design Park Co., Ltd.

13.Shenzhen Baode Computer System Co., Ltd.

14.Beijing Institute of Computer Technology and Application

15.Hengwei Technology (Shanghai) Co., Ltd.

16.Tongfang Computer Co., Ltd.

17.Inspur Electronic Information Industry Co., Ltd.

18.China Great Wall Technology Group Co., Ltd.

19.Unisplendour Hengyue Technology Co., Ltd.

20.Lenovo Changfeng Technology (Beijing) Co., Ltd.

twenty one.Beyond Technology Co., Ltd.

twenty two.Suzhou Keda Technology Co., Ltd.

twenty three.Zhejiang Dahua Technology Co., Ltd.

twenty four.Tiangu Information Security System (Shenzhen) Co., Ltd.

25.Shenzhen Tongtaiyi Information Technology Co., Ltd.

2020 Feiteng new partners

(The following ranks are in no particular order)

1.Great Wall Chaoyun (Beijing) Technology Co., Ltd.

2.Qingdao Haier Intelligent Internet Technology Co., Ltd.

3.Zhejiang Dahua Technology Co., Ltd.

4.Shanxi Baixin Information Technology Co., Ltd.

5.Beijing Digital China Cloud Technology Co., Ltd.

6.Jiangsu Guoguang Information Industry Co., Ltd.

7.Hangzhou Anheng Information Technology Co., Ltd.

8.Wuhan Climbing Dingcheng Technology Co., Ltd.

9.Pike Data Technology (Shenzhen) Co., Ltd.

10.Shenzhen Innovation Technology Co., Ltd.

11.Shenzhen Emdoor Holdings Co., Ltd.

12.Guangzhou Qixi Computer Co., Ltd.

13.Guangzhou Wuzhou Technology Co., Ltd.

14.Hefei Zhuoyi Hengtong Information Security Co., Ltd.

15.Dieyun (Shenzhen) Technology Co., Ltd.

16.Shenzhen Medijie Electronic Technology Co., Ltd.

17.Shenzhen Jiehe Technology Development Co., Ltd.

18.Shenzhen Lingyi Technology Co., Ltd.

19.Aminotech (Beijing) Technology Co., Ltd.

20.Beijing Huadian Zhongxin Technology Co., Ltd.

twenty one.Beijing Zhongke Haixun Digital Technology Co., Ltd.

twenty two.Xi’an Ruikong Chuanghe Electronic Technology Co., Ltd.

twenty three.Chengdu Qianfeng Information Technology Co., Ltd.

twenty four.Chengdu Zhimingda Electronics Co., Ltd.

25.Bangyan Technology Co., Ltd.

26.Hunan Yaxin Anhui Technology Co., Ltd.

27.Hunan Kirin Principal Technology Co., Ltd.

28.Shenzhen Jushan Database Software Co., Ltd.

29.Beijing Wanlihong Technology Co., Ltd.

30.Yunhong Information Technology Co., Ltd.

31.Suirui Technology Group Co., Ltd.

32.Shanghai Cloud Axis Information Technology Co., Ltd.

33.Shanghai Aishu Information Technology Co., Ltd.

34.Shenzhen Shanyan Data Technology Co., Ltd.

35.Sky Digital Technology Co., Ltd.

36.Tianjin Haicheng Technology Development Co., Ltd.

The Links:   LM14X79 LVH200G1201

Monthly production of 115,000 8-inch wafers, the $1.4 billion M8 project was put into production

Recently, another good news came from the integrated circuit industry in Wuxi High-tech Zone. The M8 project with a total investment of 1.4 billion US dollars was officially put into production.

It is reported that the M8 project refers to the 8-inch non-memory wafer project jointly invested and constructed by Haichen semiconductor (Wuxi) Co., Ltd. and SK Hynix System Integrated Circuit (Wuxi) Co., Ltd. The project will locate the equipment assets and related patents in Cheongju, South Korea Technology, R&D team, and customer orders were transferred to Wuxi. The total project investment will eventually reach 1.4 billion US dollars.

Source: Wuxi Bo News

Wuxi Bobao WeChat pointed out that the M8 project is mainly engaged in foundry manufacturing and sales of CIS (camera circuit), DDI (driver circuit), PMIC (power management integrated circuit) and NAND memory, and is also developing new logic and mixed-signal Chips. OEM business. After the project is put into production, it will produce 115,000 8-inch wafers per month, which is much higher than the average monthly production of 50,000 wafers by other domestic and foreign companies.

At present, the global demand for 8-inch wafers has exploded. The M8 project has scarce high-performance 8-inch equipment and first-class technology, which can produce different products from 57nm to 500nm, which helps to alleviate the current domestic 8-inch wafer capacity shortage and short supply situation , to promote the stable and orderly development of the domestic IC design industry.

The M8 project settled in Wuxi and successfully put into production will help consolidate Wuxi’s position as the southern base of China’s microelectronics industry, and will help Wuxi become a world-class comprehensive semiconductor industry hub.

Jiang Min, Deputy Mayor of Wuxi, Secretary of the Party Working Committee of the High-tech Zone, and Secretary of the Xinwu District Committee, said that the M8 project has been put into operation, setting a benchmark for the construction of global integrated circuit projects, and pushing the cooperation and development between SK hynix and Wuxi to a new level. The height of Wuxi’s integrated circuit industry also marks a new step in the development of Wuxi’s integrated circuit industry.

The Links:   LM150X08-TLA2 LQ150X1LG45 SHARP-LCD

The world’s first!Micron single chip integrates 12GB LPDDR5 memory, 256GB 96-layer flash memory

Micron announced that it has successfully trial-produced the world’s first chip “uMCP5” that integrates LPDDR5 DRAM memory particles and 96-layer stacked 3D NAND flash memory Chips, targeting mainstream and flagship 5G smartphones that pursue high-speed memory and high-performance storage. , of course, it is no problem to use it in mid-to-high-end 4G mobile phones.

Today’s 5G flagship mobile phones have LPDDR5 memory and UFS 3.0/3.1 flash memory as standard configurations, and they are all large-capacity, but since the memory in traditional mobile phones is integrated with the SoC processor, the flash memory is an independent chip. , will take up a lot of space, coupled with the sharp increase in the internal components of 5G mobile phones, the structure is very complex, and the overall design difficulty is greatly increased.

The Micron uMCP5 single-chip integrates 12GB capacity, 6400MHz frequency, dual-channel LPDDR5 memory manufactured by the second-generation 10nm process, 256GB capacity, 96-layer stacking, 3D TLC flash memory with UFS interface, and on-board controller. Externally, it is 297 pins Standard BGA package.

Micron said that the uMCP5 can save 40% of the area compared to the traditional dual-chip combination of memory and flash memory, and at the same time, the memory and storage bandwidth are increased by 50% compared with the previous generation solution.

Micron said the uMCP5 chip has been sampling to select customers, but did not disclose who.

Flash Data Map

Author: above text Q

The Links:   NL2432HC17-01B LM215WF3-SLE1

Why 10BASE-T1S is the missing Ethernet link in automotive communications

[Introduction]New IEEE Automotive Ethernet standards are emerging, and 10BASE-T1S Ethernet is one of the newest. This article discusses trends in the automotive industry that reflect changes in automotive electronics/electrical (E/E) architectures and how the new 10BASE-T1S standard supports and drives the deployment of this new architecture.

Megatrends offer new opportunities

The automotive industry is currently undergoing major changes. Automakers need to quickly provide solutions for several megatrends such as personalization, electrification, automation and total connectivity. OEMs need to overhaul their E/E architectures to support new features. While this change poses significant technical challenges, it also presents an opportunity for OEMs to start considering moving away from standalone domain-based solutions in E/E architectures, as such The solution became unwieldy with the increasing number of control modules. With this major change in architecture, OEMs can focus on developing better technology solutions while increasing aftermarket revenue through features such as vehicle personalization, sales service and over-the-air (OTA) upgrades. The industry is moving to a common new architecture, often referred to as a regional architecture, and is looking to leverage technology and experience from other industries, especially IT, to make the car a computer on wheels.

Regional architectures determine connectivity by actual physical location, not by function, with standalone domain-based architectures of the latter (connectivity by function). This change greatly reduces the number of Electronic control units (ECUs) in the car and reduces the overall cable length by up to 1 km1. Second, it decouples hardware and software, providing a service-oriented architecture (SOA). Many OEMs are investing heavily in their own software development, hoping to provide end-to-end solutions that simplify platform integration and provide more cross-functional capabilities. 2 This scalable software platform approach can minimize design changes, add new revenue streams, help reduce long-term R&D investments, shorten development cycles, and support multiple model families simultaneously.

These revolutionary architectural changes have created challenges that have prompted many OEMs to reorganize their entire organization, moving away from individual divisions responsible for specific independent domain function controllers to a more integrated, cross-functional organization.

Automotive is fast becoming the dominant area for using Ethernet devices, and widespread deployment of Ethernet in cars is one of the key foundations for the successful rollout of these new architectures. Ethernet brings the required scalability, supports multiple speed classes, is a mature and reliable transmission medium, supports a service-based architecture, and employs well-developed security and protection building blocks. Ethernet uses a well-defined, easy-to-understand OSI model to more easily manage complex networks throughout the vehicle.

Figure 1. The regional architecture of the car

Unique needs of the automotive sector

While many basic Ethernet concepts from other industries can be leveraged, automotive E/E architectures have some unique requirements that require the development of new technologies. For cars, a key factor is reducing the weight of the car, which directly affects the mileage of the car. The cable harness used today is one of the three heaviest subsystems in a car (up to 60 kg). 3 Traditional Ethernet cables use four differential pairs for data transmission, which adds weight and wiring complexity to the car and is not optimal for automotive applications. To address this, a new IEEE standard was developed that supports Ethernet transmission over a single twisted pair, in addition to shortening the length of the cable harness through a zone architecture, resulting in significant savings in cable cost and weight.

What factors are driving the demand for 10BASE-T1S?

As the concept of zone-based architectures continues to evolve, in order to take full advantage of this new architecture, it is clear that Ethernet connectivity needs to be extended to end sensors and drives. Existing legacy connectivity technologies such as FlexRay and CAN often require protocol conversion in the gateway, which can lead to increased cost, complexity and latency. Existing automotive Ethernet technologies such as 100BASE-T1 require the use of point-to-point switched connections and cannot meet the system cost requirements to support the transition to Ethernet in end-connection applications. So, IEEE calls for a solution to this problem. Some key requirements include: 4

● Enables faster communication speeds than existing technologies; eg, CAN(FD)

● Replacing traditional in-vehicle network technologies such as FlexRay

● If using 100BASE-T1 to connect the ECU is not cost-effective, an alternative to 100BASE-T1 is required

● Ability to support simple, redundant sensor network connections

What is 10BASE-T1S?

The 10BASE-T1S specification is part of the IEEE 802.3cg standard and was published in February 2020. 10BASE-T1S provides the missing link in the automotive Ethernet ecosystem, enabling true Ethernet-to-edge connectivity and addressing the needs of regional architectures.

10BASE-T1S is unique from other automotive Ethernet technologies: it supports a multipoint topology, where all nodes are connected by the same unshielded twisted pair. This bus configuration provides an optimized BOM with only one Ethernet PHY deployed on each node, eliminating the need for switching or star topologies associated with other Ethernet technologies. The standard stipulates that at least 8 nodes must be supported (more nodes can be supported), and the bus length must reach 25 meters.

Figure 2. 10BASE-T1S bus topology

Another new feature of the standard is Physical Layer Conflict Avoidance (PLCA), which, as the name suggests, avoids conflicts on shared networks. This configuration ensures that the deterministic maximum latency is mainly determined by the number of nodes in the network and the amount of data to be transmitted. Each node gets a transmission opportunity. If a node has no data to transmit at that time, it will hand over the transmission opportunity to the next node to fully utilize the available 10 Mbps bandwidth.

Since it is an AC coupled system, it also supports 10BASE-T1S network power supply. This results in further cable savings, reduced connector size, and higher reliability due to cable savings and reduced connector complexity. Power over Data Lines (PoDL) can be used for point-to-point configurations, and now as part of an improvement to the IEEE standard, multipoint topologies are also supported.

10BASE-T1S has a wide variety of applications in the automotive sector, with multiple sensors and actuators still being explored across multiple functions in body, comfort, infotainment, and ADAS systems.

in conclusion

Automotive E/E architecture is undergoing a major change. The transition to a regional E/E architecture is imminent. 10BASE-T1S provides the missing link, supporting this transition with optimized Ethernet-to-edge connectivity. During this deployment, there are still some issues to overcome, such as Ethernet connectivity adding component cost and complexity to the module implementation. 10BASE-T1S addresses these issues by reducing system cost and offering a wide selection of products that support different types of signal chain partitioning. Analog Devices is actively involved in standardization activities and works closely with OEMs to actively promote and deploy 10BASE-T1S to ensure that their system requirements are met.

Contact Analog Devices to learn about our 10BASE-T1S products and how we plan to help promote and deploy 10BASE-T1S in the automotive space.

References

1 Cariad. May 2021.

2Ryan Fletcher. “End-to-End Automotive Software Platform Use Cases.” McKinsey & Company, January 2020.

3 Dan Scott. “Wire Harness Development in Today’s Automotive Sector.” Siemens AG, July 2020.

4 Calls for 10Mb/s single twisted pair Ethernet. IEEE 802.3 Ethernet Working Group.

About the Author

Fionn Hurley is Marketing Manager for Analog Devices’ Automotive Cockpit Electronics business unit in Limerick, Ireland. He joined Analog Devices in 2007. Previously worked as an RF design engineer. He is a graduate of the University of Cork (UCC) in Ireland with a BA in Electrical and electronic Engineering. Contact: fionn.hurley@analog.com.

The Links:   6MBI100FC-060 LQ104V1DG5A

Re-evolution of safe driving, STMicroelectronics global shutter image sensor boosts the new upgrade of in-car experience

Even people who are no longer interested in driving, with the upgrade of automobile electronics in recent years, can clearly feel the huge upgrade of the driving experience. Drivers who may have needed family members to help command when they back up and enter the garage, cooperate with the outside of the car. The advanced cameras, sensors, and automatic parking technology can also easily enter the seat, and the sensing device outside the car greatly improves the driving experience and safety.

‍‍‍‍‍‍‍✦ This article is reproduced from: Feixiang.com
✦ Author: Wei Deling

Even people who are no longer interested in driving, with the upgrade of automobile electronics in recent years, can clearly feel the huge upgrade of the driving experience. Drivers who may have needed family members to help command when they back up and enter the garage, cooperate with the outside of the car. The advanced cameras, sensors, and automatic parking technology can also easily enter the seat, and the sensing device outside the car greatly improves the driving experience and safety.

However, there is still a huge room for improvement in the driving experience of the in-car world. Drivers unconsciously reply to messages with their mobile phones, or operate on the touch panel during high-speed driving, causing back pain after long-term driving. Pain and blurred eyes, and children in the back row who can be naughty and free from the safety seat, the potential safety hazards may be more sudden and risky than small scratches outside the car.

The in-car sensing market is about to grow rapidly

According to Yole’s report, the global vehicle camera sales volume is expected to be 172 million in 2021, and the sales volume will reach 364 million by 2026. Among these 5 times growth, the fastest growth rate will be the internal camera, CAGR reached 22.4%.

In the future, a car will not only have cameras and sensors outside the car, but also greatly increase the number of cameras inside the car. The vehicle evaluation standard system Euro NCAP specifically states that an effective driver monitoring system is also a prerequisite for autonomous driving to ensure the necessary Return control to a driver fit and able to drive.

This also means that the vehicle needs to have the ability to determine whether the driver can currently drive. The Driver Monitoring System (DMS) is a system that focuses on observing the driver. It can mainly monitor whether the driver is paying attention, whether he is distracted or dozing off, because these phenomena can seriously endanger driving safety.

Cabin/Occupancy Monitoring System (CMS/OMS) is mainly used to observe passenger conditions. For example, it can remind users to avoid leaving children in the car after getting out of the car. Died from being trapped in a car. In addition, the system also has the functions of detecting passenger identification, airbag adaptation, and intruder detection.

For various applications of in-vehicle perception, it is undoubtedly closely related to the popular computer vision.

Global Shutter Powers Computer Vision

“What is computer vision? In fact, most people use this technology every day.” Lin Guozhi, technical marketing manager of STMicroelectronics Asia Pacific Imaging Division, vividly introduced the current wide range of applications of this technology at a recent media conference. The current situation, whether it is the facial recognition of smartphones or laptops, or the code scanning guns used in supermarket convenience stores, all use computer vision.

At present, the global shutter image sensor is an important technical element for realizing computer vision.

As Lin Guozhi said, this technology is not unfamiliar to many people. The face recognition unlocking function on many laptops is realized through the global shutter technology, and it can also realize functions such as gesture control and privacy protection. , and then cooperate with ToF and ALS for presence detection, battery life and automatic adjustment of screen brightness.

In addition, the global shutter image sensor also plays an important role in a large number of application scenarios such as eye tracking and gesture control on AR/VR/MR, object detection and scene analysis in industrial control.

The reason why the global shutter is more in line with the requirements of computer vision than the rolling shutter is that the rolling shutter technology’s progressive image capture principle is limited by the fact that the entire image has only one frame. For fast-moving objects, the image is likely to be distorted. , the subject cannot be displayed as it is. The global shutter captures the entire image at one time, with a very short shooting time and very accurate imaging results.

For example, STMicroelectronics’ VD55G0 and VD56G3 global shutter sensors provide excellent technical guarantees for engineers to develop related computer vision functions in the field of industrial automation and consumer products. They have the highest quantum efficiency at 940nm and bring extremely high NIR. sensitivity. The resolution of the square sensor is optimally matched with the lens, which greatly shortens the sensor shooting time, enables accurate imaging and reduces system power consumption.

Realize the upgrade of in-vehicle experience

For the automotive field, RGB color images are required for cabin occupancy monitoring, and NIR images are required for driver monitoring. Currently, only a single camera can support both RGB and NIR.

Two generations of ST’s global shutter sensors are now available for in-vehicle surveillance needs.

The first generation of products has achieved the coverage of all customer needs, including four types of products: VD5661A with 1.6 million resolution, mainly used for DMS. The VD5761A has a resolution of 2.3 million and can also be used for DMS because it belongs to Mono (monochrome). And VD6763A with color RGB and VD1762A with RGB-NIR integration.

According to Lin Guozhi, technical marketing manager of STMicroelectronics Asia Pacific Imaging Division, the first-generation ST global shutter sensor has three characteristics. The first is high contrast, which can output extremely high-contrast images; the second is data management of RGB and NIR; and the third is high dynamic, even in too bright or too dark ambient conditions, HDR sensors can obtain clear images.

The second-generation product VB56G4A has a resolution of 1.5 million and is mainly used for driver monitoring. It has three characteristics of high sensitivity, small sensor area and built-in processing. It is convenient for manufacturers to install inside the mechanical device by using a smaller camera module. In addition, the intelligent automatic exposure algorithm can automate the processing and operation process without manual operation.

In other words, with the help of ST’s global shutter sensor, the functions of the driver monitoring system (DMS) and the cabin/occupancy monitoring system (CMS/OMS) can be realized for the interior of the car.

In addition, OEMs can also choose finished camera modules based on ST’s global shutter sensors, which can be directly integrated into automotive systems or sensor performance evaluation.

In addition to enabling the interior of the car to realize monitoring functions, ST’s global shutter sensor also has the possibility to realize gesture control. Manufacturers can also develop innovations based on this sensor, allowing drivers to directly use gestures. Quick control of some vehicle functions to avoid distracted operation of the touch screen, further improving safety during driving.

At the same time, STMicroelectronics also provides products such as ToF and ambient light sensors to meet the innovative needs of manufacturers to integrate into various scenarios through different products.

In the past, reversing radar was something that many old drivers looked down on. Now, all-round radar has become the standard configuration of a large number of cars, and all drivers also enjoy it. What is more worth looking forward to is that the new experience in the car is also beckoning to people.

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